Light emitting device and module

1. A micro LED chip comprising:

an LED die having a light emitting top surface and light emitting side surfaces; and

a wavelength conversion layer containing quantum dots and a photosensitive material, and disposed on the light emitting top surface, wherein the wavelength conversion layer is a thin film having a thickness equal to or less than 20 microns, wherein the wavelength conversion layer is extended to cover at least a portion of the light emitting side surfaces.

2. The micro LED chip of claim 1 , wherein the wavelength conversion layer is further extended to cover all of the light emitting side surfaces.

3. The micro LED chip of claim 1 , wherein the LED die has a thickness equal to or less than 20 microns.

4. The micro LED chip of claim 1 , wherein the light emitting top surface is a roughened surface.

5. The micro LED chip of claim 1 , wherein the light emitting side surfaces are roughened surfaces.

6. A light emitting module comprising:

a substrate;

a first blue LED die, a second blue LED die and a third blue LED die disposed on the substrate, wherein each of the first, second and third blue LED dies has a light emitting top surface and light emitting side surfaces;

a first wavelength conversion layer containing red quantum dots and a photosensitive material, and disposed over the first blue LED die such that the red quantum dots are excited to emit red lights, wherein the first wavelength conversion layer covers at least a portion of the light emitting side surfaces of the first blue LED die;

a second wavelength conversion layer containing green quantum dots and the photosensitive material, and disposed over the second blue LED die such that the green quantum dots are excited to emit green lights, wherein the photosensitive material comprises a resin and a photo initiator;

a first blue color filter layer disposed over the first wavelength conversion layer, and aligned with both the first wavelength conversion layer and the first blue LED die; and

a second blue color filter layer disposed over the second wavelength conversion layer, and aligned with both the second wavelength conversion layer and the second blue LED die.

7. The light emitting module of claim 6 , wherein the first blue color filter layer and the second blue color filter layer are not presented over the third blue LED die.

8. The light emitting module of claim 6 , wherein the first, second and third blue LED dies are configured as a display pixel.

9. The light emitting module of claim 6 , wherein the first wavelength conversion layer is at least disposed over a light emitting top surface of the first blue LED die.

10. The light emitting module of claim 6 , wherein the second wavelength conversion layer is at least disposed over a light emitting top surface of the second blue LED die.

11. A light emitting module comprising:

a substrate;

a first LED die, a second LED die and a third LED die disposed on the substrate;

a first wavelength conversion layer containing red quantum dots and a photosensitive material, and disposed over the first LED die such that the red quantum dots are excited to emit red lights;

a second wavelength conversion layer containing green quantum dots and the photosensitive material, and disposed over the second LED die such that the green quantum dots are excited to emit green lights, wherein the photosensitive material comprises a resin and a photoinitiator; and

a continuous color filter layer covering light emitting top surfaces of the first, second and third LED dies, and configured to filter out lights emitted from the first and second LED dies and to pass lights emitted from the third LED die.

12. The light emitting module of claim 11 , wherein the third LED die is configured to emit blue light.

13. The light emitting module of claim 12 , wherein the first and second LED dies are configured to emit ultraviolet lights.

14. The light emitting module of claim 13 , wherein the color filter layer is configured to filter out ultraviolet lights.

15. The light emitting module of claim 11 , wherein the first, second and third LED dies are configured as a display pixel.

16. The light emitting module of claim 11 , wherein the first wavelength conversion layer is at least disposed over a light emitting top surface of the first LED die.

17. The light emitting module of claim 11 , wherein the second wavelength conversion layer is at least disposed over a light emitting top surface of the second LED die.

18. The light emitting module of claim 11 , wherein the first, second and third LED dies are configured as a display pixel, the first and second LED dies are configured to emit lights of a first wavelength range, and the third LED die is configured to emit lights of a second wavelength range different from the first wavelength range.