Light emitting device
The light emitting device includes a growth substrate, a light-emitting semiconductor structure, conductive pillars, an insulating layer, and first and second electrodes. The light-emitting semiconductor structure includes a first-type semiconductor layer, a light-emitting layer and a second-type semiconductor layer disposed on the growth substrate from top to bottom. The conductive pillars are disposed in the light-emitting semiconductor structure. The conductive pillars penetrates is in contact with the second-type semiconductor layer and electrically connected to the substrate. A first portion of the insulating layer is disposed between the first-type semiconductor layer and the substrate, and a second portion of the insulating layer electrically insulates the first-type semiconductor layer and the light emitting-layer from the conductive pillars. The first electrode is electrically connected to the first-type semiconductor layer and electrically insulated from the conductive pillars. The second electrode is electrically connected to the conductive pillar.
1. A light emitting device, comprises:
a growth substrate;
a light emitting semiconductor structure disposed on the growth substrate, the light emitting semiconductor structure including a first-type semiconductor layer, a light emitting layer and a second-type semiconductor layer from top to bottom;
a plurality of conductive pillars disposed in the light emitting semiconductor structure at intervals, and each of the conductive pillars disposed through the first-type semiconductor layer and the light emitting layer and not disposed through the second-type semiconductor layer and in direct contact with the second-type semiconductor layer;
an insulating layer having a first portion and a second portion, the first portion disposed on the first-type semiconductor layer, and the second portion electrically insulating the first-type semiconductor layer and the light emitting layer from the conductive pillars, wherein the first portion has a trench and a plurality of openings, and the trench is adjacent to an edge of the growth substrate, and a first width of each of the openings is smaller than a second width of each of the conductive pillars;
a first electrode and a second electrode disposed on the first-type semiconductor layer, wherein the first electrode is electrically connected to the first-type semiconductor layer and electrically insulated from the conductive pillars, and the second electrode is electrically connected to the conductive pillars;
a transparent conductive layer disposed between the first-type semiconductor layer and the first portion and electrically connected to the first semiconductor layer, wherein a portion of the transparent conductive layer is exposed from the trench and the openings; and
a first electrode extension portion disposed between the first portion and the first electrode, wherein the first electrode extension portion is electrically connected to the transparent conductive layer through the trench and the openings.
2. The light emitting device of claim 1 , wherein a total length of the trench is greater than 60% of a circumference of the growth substrate.
3. The light emitting device of claim 1 , wherein the trench continuously surrounds the edge of the growth substrate.
4. The light emitting device of claim 1 , wherein the edge of the growth substrate and the nearest conductive pillar are separated by a distance, and a width of the trench is 10% to 30% of the distance.
5. The light emitting device of claim 1 , wherein a first number of the openings is greater than a second number of the conductive pillars.
6. The light emitting device of claim 1 , wherein a distance between two adjacent of the openings is greater than 1.5 times the first width.
7. The light emitting device of claim 1 ,
wherein the transparent conductive layer includes indium tin oxide.
8. The light emitting device of claim 7 , further comprising a metal layer disposed between the first electrode extension portion and the transparent conductive layer, and the metal layer fills the trench and the openings, wherein the metal layer includes silver or aluminum.