Forming method of flip-chip light emitting diode structure
The forming method of a flip-chip light emitting diode structure includes the following steps. A first substrate including a first semiconductor layer, an active layer on the first semiconductor layer and a second semiconductor layer on the active layer is provided. A first current blocking layer is formed on the second semiconductor layer, in which the first current blocking layer has a plurality of interspaces. A reflective layer covering the interspaces is formed, in which the reflective layer has a plurality of recesses, and each of the recesses is corresponding to each of the interspaces. A second current blocking layer filling into the recesses is formed.
1. A method of forming flip-chip light emitting diode structure, comprising:
providing a first substrate including a first semiconductor layer, an active layer on the first semiconductor layer, a second semiconductor layer on the active layer;
forming a first current blocking layer on the second semiconductor layer, wherein the first current blocking layer has a plurality of interspaces;
forming a reflective layer covering the interspaces, wherein the reflective layer has a plurality of recesses, and each of the recesses is corresponding to each of the interspaces; and
forming a second current blocking layer filling into the recesses.
2. The method of claim 1 , wherein before forming the first current blocking layer, further comprising:
forming an opening penetrating the second semiconductor layer and the active layer, the opening exposing a top surface of the first semiconductor layer, a sidewall of the second semiconductor layer, and a sidewall of the active layer; and
forming a transparent conductive layer on the second semiconductor layer.
3. The method of claim 2 , wherein the first current blocking layer covering the sidewall of the transparent conductive layer, the sidewall of the second semiconductor layer, the sidewall of the active layer, and the top surface.
4. The method of claim 3 , wherein the second current blocking layer covers a sidewall of the reflective layer, and the second current blocking layer covers the first current blocking layer at the opening.
5. The method of claim 1 , wherein after forming the second current blocking layer, further comprising:
forming a conductive layer covering the second current blocking layer and the reflective layer; and
forming a passive layer covering the conductive layer.
6. The method of claim 5 , wherein after forming the passive layer, further comprising:
forming a first electrode contact at an opening, wherein the first electrode contact penetrates the passive layer, the second current blocking layer and the first current blocking layer, and a bottom portion of the first electrode contact connects with the first semiconductor layer;
bonding the passive layer of the first substrate to a surface of a second substrate; and
forming a second electrode contact penetrating the first current blocking layer and the second current blocking layer, wherein a bottom portion of the second electrode contact connects with the conductive layer, and a top portion of the second electrode contact is exposed.