Assignment of Assignor's Interest

Recorded: 2025-04-29 Pages: 4

Assignors

KUO, SHIOU-YI

Executed: 2025-04-11

CHIU, JING-KAI

Executed: 2025-04-11

SU, TSUNG-HAO

Executed: 2025-04-11

MA, WEI-YUAN

Executed: 2025-04-11

Assignee

LEXTAR ELECTRONICS CORPORATION

6F, NO 21, LIXING RD, HSINCHU SCIENCE PARK, HSINCHU, 300094, TAIWAN

Covered Property (1)

Packaging Structure and Formation Method Thereof

Application: 19/191,985 →

Publication: US 2025/0366294

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.