LED package structure
A light emitting diode (LED) package structure include an electrically-insulated frame, a trough, a LED chip, a fluorescent colloid and at least two spacing members. The electrically-insulated frame has a surface with four corners. The trough is recessed in the surface. The LED chip is located in the trough. The fluorescent colloid is filled within the trough to cover the LED chip. The spacing members protrude from two of the four corners on the surface, wherein a glue escape gap is defined between each spacing member and a boundary of the trough.
1. A light emitting diode (LED) package structure comprising:
an electrically-insulated frame having a surface, wherein the surface has four corners;
a trough recessed in the surface;
an LED chip disposed in the trough;
a fluorescent colloid filled within the trough and covering the LED chip; and
at least two spacing members protruding from two of the four corners on the surface, wherein a glue escape gap is defined between each spacing member and a boundary of the trough, wherein one of the four corners is a location-recognized corner, and the at least two spacing members are located at remaining corners of the four corners except the location-recognized corner.
2. The LED package structure of claim 1 , wherein the at least two spacing members have a same height.
3. The LED package structure of claim 1 , wherein the glue escape gap is equal to a sidewall thickness of the electrically-insulated frame.
4. The LED package structure of claim 1 , wherein the surface is a rectangle, and the at least two spacing members are located at a pair of corners of the rectangle.
5. The LED package structure of claim 1 , wherein each spacing member comprises a triangular column.
6. The LED package structure of claim 1 , wherein each spacing member comprises a hemisphere.
7. The LED package structure of claim 1 , wherein each spacing member comprises a long bar.
8. The LED package structure of claim 1 , wherein each spacing member comprises a pyramid.
9. A light emitting module comprising:
a light guide plate; and
a light emitting diode (LED) package structure disposed adjacent to a sidewall of the light guide plate, wherein the LED package structure comprises:
an electrically-insulated frame having a surface, wherein the surface has four corners;
a trough recessed in the surface;
an LED chip disposed in the trough;
a fluorescent colloid filled within the trough and covering the LED chip; and
at least two spacing members protruding from two of the four corners on the surface, wherein a glue escape gap is defined between each spacing member and a boundary of the trough,
wherein the at least two spacing members are in contact with the sidewall of the light guide plate,
wherein one of the four corners is a location-recognized corner, and the at least two spacing members are located at remaining corners of the four corners except the location-recognized corner.
10. The light emitting module of claim 9 , wherein the at least two spacing members have a same height.
11. The light emitting module of claim 9 , wherein the glue escape gap is equal to a sidewall thickness of the electrically-insulated frame.
12. The light emitting module of claim 9 , wherein the surface is a rectangle, and the at least two spacing members are located at a pair of corners of the rectangle.
13. The light emitting module of claim 9 , wherein each spacing member comprises a triangular column.
14. The light emitting module of claim 9 , wherein each spacing member comprises a hemisphere.
15. The light emitting module of claim 9 , wherein each spacing member comprises a long bar.
16. The light emitting module of claim 9 , wherein each spacing member comprises a pyramid.