Method for fabricating LED chip comprising reduced mask count and lift-off processing

1. A method for fabricating a light emitting diode chip, comprising:

forming a semiconductor layer and a conductive layer sequentially on a substrate, wherein a first type semiconductor material layer, a light emitting material layer and a second type semiconductor material layer form the semiconductor layer;

forming a first patterned photoresist layer on the conductive layer, wherein the first patterned photoresist layer comprises a first photoresist block and a second photoresist block, and a thickness of the first photoresist block is thinner than a thickness of the second photoresist block;

removing a portion of the conductive layer and a portion of the semiconductor layer with the first patterned photoresist layer as a mask to form a semiconductor device layer;

reducing a thickness of the first patterned photoresist layer until the first photoresist block is removed completely and using the remaining second photoresist block as a mask to partially remove the conductive layer to form a current spreading layer, wherein the current spreading layer partially exposes the semiconductor device layer;

removing the remaining second photoresist block; and

forming a patterned dielectric layer and a plurality of electrodes on the current spreading layer and the semiconductor device layer.

2. The method for fabricating the light emitting diode chip as claimed in claim 1 , wherein the current spreading layer has an opening to expose an upper surface of the semiconductor device layer, and the patterned dielectric layer contacts with the upper surface of the semiconductor device layer through the opening.

3. The method for fabricating the light emitting diode chip as claimed in claim 1 , wherein the plurality of electrodes and the patterned dielectric layer are fabricated by different mask processes respectively.

4. The method for fabricating the light emitting diode chip as claimed in claim 1 , wherein the step of forming the patterned dielectric layer and the plurality of electrodes comprises:

forming a dielectric layer on the substrate to cover the semiconductor device layer and the current spreading layer;

forming a second patterned photoresist layer on the dielectric layer;

removing partially the dielectric layer to form the patterned dielectric layer with the second patterned photoresist layer as a mask, wherein the patterned dielectric layer exposes a portion of the semiconductor device layer and a portion of the current spreading layer;

forming an electrode material layer entirely; and

removing the second patterned photoresist layer to strip the electrode material layer thereon and form the plurality of electrodes, wherein the plurality of electrodes are electrically connected with the semiconductor device layer and the current spreading layer.

5. The method for fabricating the light emitting diode chip as claimed in claim 1 , wherein the step of forming the patterned dielectric layer and the plurality of electrodes comprises:

forming a dielectric layer on the substrate to cover the semiconductor device layer and the current spreading layer;

forming a third patterned photoresist layer on the dielectric layer, wherein the third patterned photoresist layer comprises a third photoresist block and a fourth photoresist block, and a thickness of the third photoresist block is thinner than a thickness of the fourth photoresist block;

removing partially the dielectric layer to form the patterned dielectric layer with the third patterned photoresist layer as a mask, wherein the patterned dielectric layer exposes a portion of the semiconductor device layer and a portion of the current spreading layer;

reducing a thickness of the third patterned photoresist layer until the third photoresist block is removed completely;

forming an electrode material layer entirely; and

removing the third patterned photoresist layer to strip the electrode material layer thereon and form the plurality of electrodes, wherein the plurality of electrodes are electrically connected with the semiconductor device layer and the current spreading layer.

6. The method for fabricating the light emitting diode chip as claimed in claim 5 , wherein the step of forming the third patterned photoresist layer comprises performing a half-tone mask process, a gray-tone mask process or a multi-tone mask process.

7. The method for fabricating the light emitting diode chip as claimed in claim 1 , wherein the step of forming the first patterned photoresist layer comprises performing a half-tone mask process, a gray-tone mask process or a multi-tone mask process.