IP Library Granted Patent US 11,422,296
Granted Patent B2
US 11,422,296 · App. 17/134,548 · Granted Aug 23, 2022

Light-emitting module structure

Inventors: Pei-Song Cai (Hsinchu, TW); Lung-Kuan Lai (Hsinchu, TW); Shih-Yu Yeh (Hsinchu, TW); Guan-Zhi Chen (Hsinchu, TW); Hong-Zhi Liu (Hsinchu, TW); Kuo-Yen Chang (Hsinchu, TW); Ching-Hua Li (Hsinchu, TW)
Assignee: Lextar Electronics Corporation
G02B6/0038G02B6/0023G02B6/0036G02B6/0055G02B6/0073G02B6/0083
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Quick Facts
Patent No.
US 11,422,296
App. No.
17/134,548
Granted
Aug 23, 2022
Kind
B2
Abstract

A light-emitting module structure includes a substrate, a plurality of light-emitting diodes (LEDs) disposed on the substrate, and a light-guiding layer covering the light-emitting diodes. The light-guiding layer has an upper surface, the upper surface has a plurality of recesses, and the recesses are above the light-emitting diodes or between the light-emitting diodes. This light-emitting module structure can improve the brightness and uniformity of the light-emitting module.

Claims (16)

1. A light-emitting module structure, comprising:

a substrate, wherein the substrate is an opaque substrate;

a plurality of light-emitting diodes disposed on the substrate;

a light-guiding layer covering the light-emitting diodes, wherein the light-guiding layer has an upper surface, the upper surface has a plurality of recesses, and each of the recesses is between the light-emitting diodes; and

a plurality of scattering structures disposed on the substrate, wherein the plurality of scattering structures are covered by the light-guiding layer, and an upper surface of the plurality of scattering structures is lower than the plurality of recesses.

2. The light-emitting module structure of claim 1 , further comprising a plurality of crosstalk resistant structures disposed on the substrate, wherein each of the crosstalk resistant structures is between the light-emitting diodes.

3. The light-emitting module structure of claim 2 , wherein each of the scattering structures is arranged between two adjacent ones of the light-emitting diodes and disposed on two opposite sides of each of the crosstalk resistant structures.

4. The light-emitting module structure of claim 3 , further comprising a plurality of reflection structures disposed on the substrate, wherein each of the reflection structures is arranged between two adjacent ones of the light-emitting diodes and disposed on two opposite sides of each of the crosstalk resistant structures.

5. The light-emitting module structure of claim 2 , wherein the light-emitting diodes are arranged as a regular hexagon, and each of the crosstalk resistant structures is positioned at a center of the regular hexagon.

6. The light-emitting module structure of claim 2 , wherein the crosstalk resistant structures comprise a plurality of cones or a plurality of cylinders, and each of the crosstalk resistant structures has a height that is greater than or equal to a height of the light-emitting diodes.

7. The light-emitting module structure of claim 1 , further comprising at least one reflection structure disposed on a part of the upper surface of the light-guiding layer, wherein the reflection structure has a reflection surface immediately neighboring the upper surface, and the reflection surface is a scattering reflection surface or a mirror reflection surface.

8. The light-emitting module structure of claim 1 , wherein the recesses comprise a plurality of first V-shaped trenches extending along a first direction.

9. The light-emitting module structure of claim 8 , wherein the recesses further comprise a plurality of second V-shaped trenches extending along a second direction, the second direction is different from the first direction, the first V-shaped trenches intersect with the second V-shaped trenches to form a plurality of intersections.

10. The light-emitting module structure of claim 1 , further comprising a transparent glue layer on the upper surface of the light-guiding layer, wherein the transparent glue layer fills the recesses.

11. The light-emitting module structure of claim 10 , wherein the transparent glue layer in the recesses has a protruding glue accumulation portion.

12. The light-emitting module structure of claim 1 , wherein the substrate has at least one cavity, and at least one of the light-emitting diodes is correspondingly disposed in the at least one cavity, wherein the light-emitting diodes are chip size package light-emitting diodes.

Assignments (2)
MERGER Recorded Mar 27, 2026
From: LEXTAR ELECTRONICS CORPORATION
To: ENNOSTAR CORPORATION
Reel/Frame 075286/0822 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 28, 2020
From: CAI, PEI-SONG; LAI, LUNG-KUAN; YEH, SHIH-YU; CHEN, GUAN-ZHI; LIU, HONG-ZHI; CHANG, KUO-YEN; LI, CHING-HUA
To: LEXTAR ELECTRONICS CORPORATION
Reel/Frame 054759/0290 →