Light emitting device and backlight module
A light emitting device includes a circuit board, light-emitting diodes, an optically clear adhesive layer and a transparent film. The light-emitting diodes are disposed on a surface of the circuit board. The optically clear adhesive layer is disposed on the surface of the circuit board and covers the light-emitting diodes. The transparent film is disposed over a side of the optically clear adhesive layer distant from the circuit board. A hardness of the transparent film is greater than a hardness of the optically clear adhesive layer.
1. A light emitting device, comprising:
a circuit board;
a plurality of light-emitting diodes disposed on a surface of the circuit board;
an optically clear adhesive layer disposed on the surface of the circuit board and covering the light-emitting diodes, the optically clear adhesive layer filling gaps between the light-emitting diodes; and
a transparent film disposed over a side of the optically clear adhesive layer distant from the circuit board, wherein a hardness of the transparent film is greater than a hardness of the optically clear adhesive layer.
2. The light emitting device of claim 1 , wherein a refractive index of the transparent film is greater than a refractive index of the optically clear adhesive layer.
3. The light emitting device of claim 1 , wherein the transparent film is formed from materials comprising at least one of polyethylene terephthalate, polycarbonate, polymethyl methacrylate, cellulose triacetate, and polypropylene.
4. The light emitting device of claim 1 , wherein a distance between a surface of the transparent film distant from the optically clear adhesive layer and the circuit board is smaller than 1.5 mm.
5. The light emitting device of claim 1 , wherein the light-emitting diodes comprise blue light-emitting diodes.
6. The light emitting device of claim 5 , further comprising a wavelength conversion layer that is disposed on a side of the transparent film distant from the optically clear adhesive layer or is disposed between the optically clear adhesive layer and the transparent film, wherein the wavelength conversion layer is configured to convert a portion of blue light emitted by the blue light-emitting diodes to non-blue light.
7. The light emitting device of claim 6 , wherein the wavelength conversion layer comprises a first wavelength conversion material configured to generate light having a main peak wavelength falling within a yellow spectral range.
8. The light emitting device of claim 6 , wherein the wavelength conversion layer comprises a second wavelength conversion material configured to generate light having a main peak wavelength falling within a green spectral range, and a third wavelength conversion material configured to generate light having a main peak wavelength falling within a red spectral range.
9. The light emitting device of claim 1 , wherein the light-emitting diodes comprise LED chips, mini LED chips, micro LED chips, or LED packages.
10. The light emitting device of claim 1 , further comprising a wavelength conversion material disposed over the light-emitting diodes.
11. The light emitting device of claim 1 , further comprising a wavelength conversion material distributed in the optically clear adhesive layer or the transparent film.
12. The light emitting device of claim 1 , wherein a surface of the transparent film away from the optically clear adhesive layer has a plurality of optical pattern groups configured to reflect light emitted by the light-emitting diodes.
13. The light emitting device of claim 12 , wherein each of the optical pattern groups comprises a plurality of reflective patterns, each of the optical pattern groups has a center aligned with a corresponding one of the light-emitting diodes, and the reflective patterns in each of the optical pattern groups are arranged outwardly from the center in order of decreasing size.
14. The light emitting device of claim 13 , wherein the reflective patterns are formed from materials comprising at least one of aluminum oxide, boron nitride, microcellular polyethylene terephthalate, barium sulfate, calcium carbonate, titanium dioxide and silicon dioxide.
15. A backlight module, comprising the light emitting device of claim 1 .
16. The backlight module of claim 15 , wherein a refractive index of the transparent film is greater than a refractive index of the optically clear adhesive layer.
17. The backlight module of claim 15 , wherein a distance between a surface of the transparent film distant from the optically clear adhesive layer and the circuit board is smaller than 1.5 mm.
18. The backlight module of claim 15 , wherein the light-emitting diodes comprise blue light-emitting diodes.
19. The backlight module of claim 18 , wherein the light emitting device further comprises a wavelength conversion layer that is disposed on a side of the transparent film distant from the optically clear adhesive layer or is disposed between the optically clear adhesive layer and the transparent film, wherein the wavelength conversion layer is configured to convert a portion of blue light emitted by the blue light-emitting diodes to non-blue light.
20. The backlight module of claim 15 , wherein a surface of the transparent film away from the optically clear adhesive layer has a plurality of optical pattern groups configured to reflect light emitted by the light-emitting diodes.