HYBRID ENCAPSULATION FILM AND METHOD OF MANUFACTURING LIGHT-EMITTING DEVICE USING THE SAME

1 . A method of manufacturing a light-emitting device, comprising:

providing a substrate;

providing a light-emitting structure comprising a plurality of solid-state light sources disposed on the substrate; and

providing a hybrid encapsulation film for encapsulating the light-emitting structure, wherein the hybrid encapsulation film comprises:

a B-stage light-transmitting layer having a front surface and a back surface; and

a plurality of first reflective layers disposed at intervals on the front surface of the B-stage light-transmitting layer;

laminating the back surface of the B-stage light-transmitting layer of the hybrid encapsulation film toward the solid-state light sources of the light-emitting structure, so that the solid-state light sources are embedded in the B-stage light-transmitting layer and respectively correspond to positions of the first reflective layers; and

performing a thermal process to cure the B-stage light-transmitting layer.

2 . The method of claim 1 , wherein the step of providing the hybrid encapsulation film comprises:

providing a first carrier;

disposing the first reflective layers on the first carrier at intervals, wherein the first reflective layers are in a C-stage state or a B-stage state; and

flipping the first carrier so that the first reflective layers are laminated toward the front surface of the B-stage light-transmitting layer, such that the first reflective layers are in direct contact with the B-stage light-transmitting layer.

3 . The method of claim 1 , wherein the step of performing the thermal process comprises curing the first reflective layers.

4 . The method of claim 2 , further comprising removing the first carrier.

5 . The method of claim 2 , wherein the step of providing the first carrier comprises forming a release film on the first carrier and the first reflective layers are disposed on the release film.

6 . The method of claim 1 , wherein the thermal process is performed at a temperature of 130° C. to 170° C. for 0.5 hours to 5 hours.

7 . The method of claim 1 , wherein a transmittance of the B-stage light-transmitting layer is greater than 85% for a light-emitting wavelength of the light-emitting structure.

8 . A method of manufacturing a light-emitting device, comprising:

providing a substrate;

providing a light-emitting structure comprising a plurality of solid-state light sources disposed on the substrate; and

providing a hybrid encapsulation film for encapsulating the light-emitting structure, wherein the hybrid encapsulation film comprises:

a B-stage light-transmitting layer having a front surface and a back surface;

a plurality of first reflective layers disposed at intervals on the front surface of the B-stage light-transmitting layer; and

a second reflective layer on the back surface of the B-stage light-transmitting layer, wherein the second reflective layer has a plurality of openings corresponding to positions of the first reflective layers to partially expose the back surface of the B-stage light-transmitting layer;

aligning the openings of the second reflective layer of the hybrid encapsulation film to the solid-state light sources of the light-emitting structure respectively;

laminating the exposed back surface of the B-stage light-transmitting layer toward the solid-state light sources, so that the solid-state light sources are embedded in the B-stage light-transmitting layer and respectively correspond to positions of the first reflective layers; and

performing a thermal process to cure the B-stage light-transmitting layer.

9 . The method of claim 8 , wherein a method of manufacturing the hybrid encapsulation film comprises:

providing a first carrier;

disposing the first reflective layers on the first carrier at intervals, wherein the first reflective layers are in a C-stage state or a B-stage state; and

flipping the first carrier so that the first reflective layers are laminated toward the front surface of the B-stage light-transmitting layer, such that the first reflective layers are in direct contact with the B-stage light-transmitting layer;

providing a second carrier;

forming the second reflective layer on the second carrier, wherein the second reflective layer is in a C-stage state or a B-stage state and has the openings; and

laminating the second reflective layer toward the back surface of the B-stage light-transmitting layer, wherein the openings respectively correspond to positions of the first reflective layers.

10 . The method of claim 9 , wherein the step of laminating the second reflective layer toward the back surface of the B-stage light-transmitting layer comprises filling the openings of the second reflective layer with the B-stage light-transmitting layer.

11 . The method of claim 9 , wherein the step of laminating the second reflective layer toward the back surface of the B-stage light-transmitting layer comprises:

providing an additional B-stage light-transmitting layer having a first surface and a second surface opposite to each other;

laminating the second reflective layer to the second surface of the additional B-stage light-transmitting layer; and

laminating the first surface of the additional B-stage light-transmitting layer toward the back surface of the B-stage light-transmitting layer.

12 . The method of claim 11 , wherein the step of performing the thermal process comprises curing the additional B-stage light-transmitting layer, the first reflective layers, and the second reflective layer.

13 . The method of claim 9 , further comprising removing the first carrier and the second carrier.

14 . A hybrid encapsulation film for encapsulating a light-emitting structure, comprising:

a B-stage light-transmitting layer having a front surface and a back surface; and

a plurality of first reflective layers disposed at intervals on the front surface of the B-stage light-transmitting layer, wherein the first reflective layers are in direct contact with the B-stage light-transmitting layer.

15 . The hybrid encapsulation film of claim 14 , wherein a material of the B-stage light-transmitting layer is silicone or epoxy resin.

16 . The hybrid encapsulation film of claim 14 , wherein a thickness of the B-stage light-transmitting layer is in a range of 150 μm to 400 μm.

17 . The hybrid encapsulation film of claim 14 , wherein the first reflective layers in a C-stage state or a B-stage state include polymer materials doped with reflective particles.

18 . The hybrid encapsulation film of claim 14 , further comprising a second reflective layer disposed on the back surface of the B-stage light-transmitting layer, wherein the second reflective layer has a plurality of openings corresponding to positions of the first reflective layers.

19 . The hybrid encapsulation film of claim 18 , wherein the second reflective layer in a C-stage state or a B-stage state include polymer materials doped with reflective particles.

20 . The hybrid encapsulation film of claim 18 , wherein the second reflective layer is embedded in the B-stage light-transmitting layer.