Semiconductor chip structure
View Patent ↗A semiconductor chip structure including a semiconductor chip having a pair of electrodes is disclosed. The electrodes have different conductivity types for electrical connection, respectively. A thermoelectric cooling material layer is disposed within each of the pair of electrodes, respectively.
1. A semiconductor chip structure, comprising:
a semiconductor chip having a pair of electrodes, wherein the electrodes have different conductivity types for electrical connection; and
a thermoelectric cooling material layer disposed within each of the pair of electrodes;
wherein an operating current I opt applied to each of the thermoelectric cooling material layers is in a range of
α
T
c
-
(
α
T
c
)
2
-
2
k
ρ
Δ
T
ρ
<
I
opt
×
L
/
A
<
α
T
c
+
(
α
T
c
)
2
-
2
k
ρ
Δ
T
ρ
,
and wherein L represents a length of the thermoelectric cooling material layer, A represents a contact area of the thermoelectric cooling material layer, T c represents a cold-end temperature, T h represents a hot-end temperature, α represents a seeback coefficient, ρ represents a resistivity of the thermoelectric cooling material layer, k represents a thermal conductivity of the thermoelectric cooling material layer, and ΔT represents a temperature difference between T c and T h .
2. The semiconductor chip structure as claimed in claim 1 , wherein the pair of electrodes comprises a P-type electrode and an N-type electrode.
3. The semiconductor chip structure as claimed in claim 2 , wherein the P-type electrode and the N-type electrode comprise a wire layer.
4. The semiconductor chip structure as claimed in claim 3 , wherein the P-type electrode and the N-type electrode further comprise an adhesive layer.
5. The semiconductor chip structure as claimed in claim 4 , wherein the adhesive layer comprises a single layer or multiple layers.
6. The semiconductor chip structure as claimed in claim 4 , wherein each of the thermoelectric cooling material layers is interposed between the wire layer and the adhesive layer.
7. The semiconductor chip structure as claimed in claim 6 , wherein the wire layer and the adhesive layer have different temperatures.
8. The semiconductor chip structure as claimed in claim 1 , further comprising a power unit electrically connected to the P-type electrode and the N-type electrode to construct a same electrical circuit.
9. The semiconductor chip structure as claimed in claim 1 , wherein the semiconductor chip is a light-emitting diode chip or a high-voltage flip chip.
10. The semiconductor chip structure as claimed in claim 1 , wherein the thermoelectric cooling material layers comprise BiSb, Bi 2 Te 3 , PbTe, CeFe 4-x Co x Sb 12 or SiGe.