IP Library Granted Patent US 12,412,874
Granted Patent B2
US 12,412,874 · App. 18/460,673 · Granted Sep 9, 2025

Pixel array package structure and display panel

Inventors: Hui-Ru Wu (Hsinchu, TW); Jian-Chin Liang (Hsinchu, TW); Jo-Hsiang Chen (Hsinchu, TW); Lung-Kuan Lai (Hsinchu, TW); Cheng-Yu Tsai (Hsinchu, TW); Hsin-Lun Su (Hsinchu, TW); Ting-Kai Chen (Hsinchu, TW)
Assignee: Lextar Electronics Corporation
H01L25/0753H10H20/856H10K50/125H10K50/856H10K50/865H10K50/868H10K59/878H10K59/8792H10K59/8793
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Quick Facts
Patent No.
US 12,412,874
App. No.
18/460,673
Granted
Sep 9, 2025
Kind
B2
Abstract

A pixel array package structure includes: a substrate; a pixel array disposed on the substrate, in which the pixel array includes a plurality of light emitting diode chips, and the light emitting diode chips include at least one red diode chip, at least one green diode chip, at least one blue diode chip, and a combination thereof; a reflective layer disposed on the substrate and between any two adjacent of the light emitting diode chips; a light-absorbing layer disposed on the reflective layer and surrounding the pixel array; and a light-transmitting layer disposed on the pixel array, the reflective layer, and the light-absorbing layer, in which the light-transmitting layer has an upper surface and a lower surface opposite thereto, and the lower surface is in contact with the pixel array, and the upper surface has a roughness of 0.005 mm to 0.1 mm.

Claims (26)

1. A pixel array package structure, comprising:

a substrate;

a pixel array disposed on the substrate, wherein the pixel array comprises a plurality of light emitting diode chips, and the plurality of light emitting diode chips comprise a red diode chip, a green diode chip, a blue diode chip, and a combination thereof;

a reflective layer disposed on the substrate and between any two adjacent of the plurality of light emitting diode chips;

a light-absorbing layer embedded in the reflective layer and surrounding the pixel array; and

a light-transmitting layer disposed on the pixel array, the reflective layer, and the light-absorbing layer, wherein the light-transmitting layer has an upper surface and a lower surface opposite thereto, and the lower surface is in contact with the pixel array.

2. The pixel array package structure of claim 1 , further comprising an anti-external light material disposed on the light-transmitting layer.

3. The pixel array package structure of claim 2 , wherein the anti-external light material is a polarizer.

4. The pixel array package structure of claim 1 , wherein the reflective layer is composed of a mixture of a colloidal material and inorganic particles, wherein the inorganic particles comprise titanium dioxide, boron nitride, silicon dioxide, barium sulfate or aluminum oxide.

5. The pixel array package structure of claim 1 , wherein an upper surface of the light-absorbing layer is substantially coplanar with an upper surface of the pixel array.

6. The pixel array package structure of claim 1 , wherein the light-absorbing layer is composed of a colloidal material and an inorganic material, or a colloidal material and an organic material.

7. The pixel array package structure of claim 6 , wherein the inorganic material is carbon powder or perovskite.

8. The pixel array package structure of claim 7 , wherein the carbon powder has a specific surface area of 50 m 2 /g to 70 m 2 /g.

9. A display panel, comprising:

a plurality of sub-display panels, any two adjacent of the sub-display panels having a splicing gap, wherein each of the sub-display panels comprises a plurality of the pixel array package structures of claim 1 .

10. The display panel of claim 9 , further comprising an anti-external light material disposed on the light-transmitting layer.

11. The display panel of claim 10 , wherein the anti-external light material is a polarizer.

12. The display panel of claim 9 , wherein the reflective layer is composed of a mixture of a colloidal material and inorganic particles, wherein the inorganic particles comprise titanium dioxide, boron nitride, silicon dioxide, barium sulfate or aluminum oxide.

13. The display panel of claim 9 , wherein an upper surface of the light-absorbing layer is substantially coplanar with an upper surface of the pixel array.

14. The display panel of claim 9 , wherein the light-absorbing layer is composed of a colloidal material and an inorganic material, or a colloidal material and an organic material.

15. The display panel of claim 14 , wherein the inorganic material is carbon powder or perovskite.

16. The display panel of claim 15 , wherein the carbon powder has a specific surface area of 50 m 2 /g to 70 m 2 /g.

17. The display panel of claim 9 , wherein the splicing gap between the sub-display panels is less than 100 μm.

18. The display panel of claim 9 , wherein any two adjacent of the pixel array package structures have a pitch therebetween.

19. The display panel of claim 18 , wherein the LED chips in the pixel array package structure are micro LEDs, the pitch between the pixel array package structures is less than 0.5 mm.

20. The display panel of claim 18 , wherein the LED chips in the pixel array package structure are mini LEDs, the pitch between the pixel array package structures is about 0.5 mm to 1.0 mm.

Assignments (2)
MERGER Recorded Mar 27, 2026
From: LEXTAR ELECTRONICS CORPORATION
To: ENNOSTAR CORPORATION
Reel/Frame 075286/0822 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 5, 2023
From: WU, HUI-RU; LIANG, JIAN-CHIN; CHEN, JO-HSIANG; LAI, LUNG-KUAN; TSAI, CHENG-YU; SU, HSIN-LUN; CHEN, TING-KAI
To: LEXTAR ELECTRONICS CORPORATION
Reel/Frame 064787/0787 →
Priority Claims (1)
TW 107129351 · Aug 22, 2018 · national
Continuity (3)
Continuation 17663431 · May 15, 2022
Division 16232041 · Dec 25, 2018
Related Publication 20230413594A1 · Dec 21, 2023
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