Light-emitting diode chip package

1. A light-emitting diode chip package, comprising:

a substrate;

a light-emitting diode chip set (LED chip set) disposed over the substrate, wherein the LED chip set is formed by a plurality of light-emitting diode chips (LED chips) in one piece, wherein the LED chip set comprises a semiconductor substrate and the plurality of LED chips formed in the semiconductor substrate;

at least two electrodes disposed over the substrate and electrically connected to the LED chip set; and

a fluorescent sheet disposed over the LED chip set.

2. The light-emitting diode chip package as claimed in claim 1 , wherein the plurality of LED chips are electrically connected to each other by a wire in the semiconductor substrate.

3. The light-emitting diode chip package as claimed in claim 1 , wherein the plurality of LED chips are juxtaposed.

4. The light-emitting diode chip package as claimed in claim 1 , further comprising:

at least one pillar portion disposed over the substrate, wherein at least one of the electrodes is disposed over the at least one pillar portion.

5. The light-emitting diode chip package as claimed in claim 4 ,

wherein a height difference between a top surface of the electrode disposed over the pillar portion and a top surface of the fluorescent sheet ranges from about 0 μm to about 50 μm.

6. The light-emitting diode chip package as claimed in claim 5 , wherein a height of the top surface of the electrode disposed over the pillar portion is equal to that of the top surface of the fluorescent sheet.

7. The light-emitting diode chip package as claimed in claim 4 , wherein each of the pillar portions comprises a conductive via, wherein the conductive via electrically connects the electrode and the substrate.

8. The light-emitting diode chip package as claimed in claim 7 , wherein the LED chip set is electrically connected to the at least two electrodes by a conductive layer disposed in or disposed over the substrate.

9. The light-emitting diode chip package as claimed in claim 4 , wherein the LED chip set is electrically connected to the at least two electrodes by a solid wire.

10. The light-emitting diode chip package as claimed in claim 4 , wherein the electrode is disposed over a top surface and a sidewall of the pillar portion, and the electrode is electrically connected to the substrate through a portion of the electrode disposed over the sidewall of the pillar portion.

11. The light-emitting diode chip package as claimed in claim 4 , wherein the light-emitting diode chip package comprises two pillar portions disposed at two corner regions of the substrate.

12. The light-emitting diode chip package as claimed in claim 4 , wherein the light-emitting diode chip package comprises four pillar portions disposed at four corner regions of the substrate.

13. The light-emitting diode chip package as claimed in claim 1 , further comprising:

a rectangular portion disposed over the substrate, wherein the at least two electrodes are disposed over the rectangular portion.

14. The light-emitting diode chip package as claimed in claim 13 , further comprising:

wherein a height difference between a top surface of the electrode disposed over the rectangular portion and a top surface of the fluorescent sheet ranges from about 0 μm to about 50 μm.

15. A light-emitting diode chip package, comprising:

a substrate;

a light-emitting diode chip set (LED chip set) disposed over the substrate, wherein the LED chip set is formed by wafer level chip scale packaging, wherein the LED chip set comprises a semiconductor substrate and a plurality of LED chips formed in the semiconductor substrate;

at least two electrodes disposed over the substrate and electrically connected to the LED chip set; and

a fluorescent sheet disposed over the LED chip set.

16. The light-emitting diode chip package as claimed in claim 15 , wherein the plurality of LED chips are electrically connected to each other by a wire in the semiconductor substrate.

17. The light-emitting diode chip package as claimed in claim 15 , wherein the plurality of LED chips are juxtaposed.

18. The light-emitting diode chip package as claimed in claim 15 , further comprising:

at least one pillar portion disposed over the substrate, wherein at least one of the electrodes is disposed over the at least one pillar portion.

19. The light-emitting diode chip package as claimed in claim 18 ,

wherein a height difference between a top surface of the electrode disposed over the pillar portion and a top surface of the fluorescent sheet ranges from about 0 μm to about 50 μm.

20. The light-emitting diode chip package as claimed in claim 19 , wherein a height of the top surface of the electrode disposed over the pillar portion is equal to that of the top surface of the fluorescent sheet.

21. The light-emitting diode chip package as claimed in claim 18 , wherein each of the pillar portions comprises a conductive via, wherein the conductive via electrically connects the electrode and the substrate.

22. The light-emitting diode chip package as claimed in claim 21 , wherein the LED chip set is electrically connected to the at least two electrodes by a conductive layer disposed in or disposed over the substrate.

23. The light-emitting diode chip package as claimed in claim 18 , wherein the LED chip set is electrically connected to the at least two electrodes by a solid wire.

24. The light-emitting diode chip package as claimed in claim 18 , wherein the electrode is disposed over a top surface and a sidewall of the pillar portion, and the electrode is electrically connected to the substrate through a portion of the electrode disposed over the sidewall of the pillar portion.

25. The light-emitting diode chip package as claimed in claim 18 , wherein the light-emitting diode chip package comprises two pillar portions disposed at two corner regions of the substrate.

26. The light-emitting diode chip package as claimed in claim 18 , wherein the light-emitting diode chip package comprises four pillar portions disposed at four corner regions of the substrate.

27. The light-emitting diode chip package as claimed in claim 15 , further comprising:

a rectangular portion disposed over the substrate, wherein the at least two electrodes are disposed over the rectangular portion.

28. The light-emitting diode chip package as claimed in claim 27 , further comprising:

wherein a height difference between a top surface of the electrode disposed over the rectangular portion and a top surface of the fluorescent sheet ranges from about 0 μm to about 50 μm.

29. A light-emitting diode chip package, comprising:

a substrate;

a light-emitting diode chip set (LED chip set) disposed over the substrate, wherein the LED chip set is formed by a plurality of light-emitting diode chips (LED chips) in one piece, wherein the LED chip set comprises a semiconductor substrate, and the plurality of LED chips are formed in the semiconductor substrate; and

at least two electrodes disposed over the substrate and electrically connected to the LED chip set,

wherein the plurality of LED chips are juxtaposed.

30. A light-emitting diode chip package, comprising:

a substrate;

a light-emitting diode chip set (LED chip set) disposed over the substrate, wherein the LED chip set is formed by a plurality of light-emitting diode chips (LED chips) in one piece, wherein the LED chip set comprises a semiconductor substrate, and the plurality of LED chips are formed in the semiconductor substrate;

at least two electrodes disposed over the substrate and electrically connected to the LED chip set; and

at least one pillar portion disposed over the substrate, wherein at least one of the electrodes is disposed over the at least one pillar portion,

wherein each of the pillar portions has a conductive via formed therein, wherein the conductive via electrically connects the electrode and the substrate.