Light emitting diode package, divisional display module, and display panel
A light emitting diode (LED) package includes a substrate, at least one micro LED chip, a black material layer, and a transparent material layer. The substrate has a width ranging from 100 micrometers to 1000 micrometers. The at least one micro LED chip is electrically mounted on a top surface of the substrate and has a width ranging from 1 micrometer to 100 micrometers. The black material layer covers the top surface of the substrate to expose the at least one micro LED chip. The transparent material layer covers the at least one micro LED chip and the black material layer.
1. A divisional display module, comprising:
a division circuit board;
a plurality of light emitting diode (LED) packages mounted on the division circuit board; and
an encapsulation layer covering the LED packages and the division circuit board, wherein each LED package comprises:
a substrate having a width;
a plurality of micro LED chips electrically mounted on a top surface of the substrate, wherein each micro LED chip has a thickness smaller than 10 micrometers;
a black material layer covering the top surface of the substrate and exposing the plurality of micro LED chips, wherein each micro LED chip has the thickness substantially equal to that of the black material layer; and
a transparent material layer covering the plurality of micro LED chips, and the transparent material layer having a thickness, wherein a ratio of the width of the substrate to the thickness of the transparent material layer is equal to or greater than 4.
2. The divisional display module of claim 1 , wherein
the black material layer comprises a thickness of 3 micrometers and a reflectivity smaller than 10%.
3. The divisional display module of claim 1 , wherein the transparent material layer has a top texture surface.
4. The divisional display module of claim 1 , wherein each micro LED chip comprises:
a first semiconductor layer having a light emitting surface exposed outside and the light emitting surface has a rough texture;
a light emitting layer disposed on the first semiconductor layer;
a second semiconductor layer disposed on the light emitting layer, wherein the second semiconductor layer has a type that is different from the first semiconductor layer; and
a supporting breakpoint on the light emitting surface.
5. The divisional display module of claim 1 , wherein the plurality of micro LED chips include a blue micro LED chip, a green micro LED chip, and a red micro LED chip.
6. The divisional display module of claim 1 , wherein the width of the substrate ranges from 100 micrometers to 1000 micrometers.
7. The divisional display module of claim 1 , wherein the black material layer is in contact with a sidewall of each micro LED chip.
8. The divisional display module of claim 1 , wherein each micro LED chip comprises a light emitting surface having a first area, the top surface of the substrate has a second area, a ratio of the first area to the second area is equal to or smaller than 5%.
9. The divisional display module of claim 1 , wherein the thickness of the transparent material layer is smaller than 100 micrometers.
10. The divisional display module of claim 1 , wherein the transparent material layer is a transparent dielectric layer or a transparent resin layer.
11. A light emitting diode (LED) display panel, comprising:
a plurality of divisional display modules, wherein each divisional display module comprises:
a division circuit board;
a plurality of LED packages mounted on the division circuit board; and
an encapsulation layer covering the LED packages and the division circuit board, wherein each LED package comprises:
a substrate having a width;
a plurality of micro LED chips electrically mounted on a top surface of the substrate, wherein each micro LED chip has a thickness smaller than 10 micrometers;
a black material layer covering the top surface of the substrate and exposing the plurality of micro LED chips, wherein each micro LED chip has the thickness substantially equal to that of the black material layer; and
a transparent material layer covering the plurality of micro LED chips, and the transparent material layer having a thickness, wherein a ratio of the width of the substrate to the thickness of the transparent material layer is equal to or greater than 4.
12. The LED display panel of claim 11 , wherein the black material layer comprises a black photoresist having a reflectivity smaller than 10%.
13. The LED display panel of claim 11 , wherein the transparent material layer is a transparent dielectric layer or a transparent resin layer.
14. The LED display panel of claim 11 , wherein each micro LED chip comprises:
a first semiconductor layer having a light emitting surface exposed outside and the light emitting surface has a rough texture;
a light emitting layer disposed on the first semiconductor layer;
a second semiconductor layer disposed on the light emitting layer, wherein the second semiconductor layer has a type that is different from the first semiconductor layer; and
a supporting breakpoint on the light emitting surface.
15. The LED display panel of claim 11 , wherein each LED package further comprises a pixel controller configured to control the plurality of micro LED chips.
16. The LED display panel of claim 15 , wherein the division circuit board further comprises a system controller to control the pixel controller included in each LED package.
17. The LED display panel of claim 11 , wherein the transparent material layer has a thickness smaller than 100 micrometers.
18. The LED display panel of claim 11 , wherein the width of the substrate ranges from 400 micrometers to 1000 micrometers.
19. The LED display panel of claim 13 , wherein the transparent dielectric layer comprises SiO 2 , Al 2 O 3 , TiO 2 , Ta 2 O 5 , HfO 2 , ZrO 2 , Y 2 O 3 , MgF 2 or Si 3 N 4 .
20. The LED display panel of claim 13 , wherein the transparent dielectric layer is formed by a chemical vapor deposition process or an atomic layer deposition process.