IP Library Granted Patent US 11,357,145
Granted Patent B2
US 11,357,145 · App. 16/693,399 · Granted Jun 7, 2022

Picking apparatus capable of picking up target micro-elements

Inventors: Chi-Wei Liu (Hsinchu, TW); Fu-Hsin Chen (Hsinchu, TW); Yu-Chun Lee (Hsinchu, TW)
Assignee: Lextar Electronics Corporation
H05K13/0404B25J15/008B25J15/0408
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Quick Facts
Patent No.
US 11,357,145
App. No.
16/693,399
Granted
Jun 7, 2022
Kind
B2
Abstract

A picking apparatus is configured to pick up a plurality of micro elements. The picking apparatus includes a main body and a plurality of picking portions. The picking portions connect with and protrude from the main body. Each of the picking portions has a first surface. The first surfaces are away from the main body and configured to pick up the micro elements. The main body has a second surface at least partially located between the picking portions. Each of the first surfaces has a first viscosity. The second surface has a second viscosity. The second viscosity is less than the first viscosity.

Claims (15)

1. A picking apparatus, configured to pick up a plurality of micro elements which are disposed on a third surface of a carrier substrate, the picking apparatus comprising:

a main body; and

a plurality of picking portions connected with and protruding from the main body, each of the picking portions having a first surface, the first surfaces being away from the main body and configured to pick up the micro elements, the main body having a second surface at least partially located between the picking portions,

wherein each of the first surfaces has a first viscosity, the second surface has a second viscosity, the third surface has a third viscosity, the first viscosity is substantially larger than the third viscosity, the second viscosity is less than the first viscosity and the third viscosity.

2. The picking apparatus of claim 1 , wherein the second viscosity is less than about 2 g/mm 2 .

3. The picking apparatus of claim 1 , wherein the first viscosity is larger than about 10 g/mm 2 .

4. The picking apparatus of claim 1 , wherein the main body comprises:

a subsidiary main body, the picking portions connect with and protrude from the subsidiary main body; and

an anti-adhesion layer connected with the subsidiary main body and at least partially located between the picking portions, the second surface located on a side of the anti-adhesion layer away from the subsidiary main body, the first surfaces are farther away from the subsidiary main body than the second surface.

5. The picking apparatus of claim 4 , wherein the anti-adhesion layer comprises organic material containing fluorine.

6. The picking apparatus of claim 4 , wherein the anti-adhesion layer comprises organic silicon.

7. The picking apparatus of claim 4 , wherein the anti-adhesion layer comprises boron nitride.

8. The picking apparatus of claim 4 , wherein the anti-adhesion layer is metallic coating.

9. The picking apparatus of claim 1 , wherein the main body comprises elastic material.

10. The picking apparatus of claim 1 , further comprising a substrate connected on a side of the main body away from the picking portions.

Assignments (2)
MERGER Recorded Mar 27, 2026
From: LEXTAR ELECTRONICS CORPORATION
To: ENNOSTAR CORPORATION
Reel/Frame 075286/0822 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 25, 2019
From: LIU, CHI-WEI; CHEN, FU-HSIN; LEE, YU-CHUN
To: LEXTAR ELECTRONICS CORPORATION
Reel/Frame 051111/0049 →
Cited By (1)
US 12,678,978