IP Library Granted Patent US 11,670,748
Granted Patent B2
US 11,670,748 · App. 17/195,539 · Granted Jun 6, 2023

LED package structure

Inventors: Chang-Han Chen (Hsinchu, TW); Chun-Peng Lin (Hsinchu, TW); Lung-Kuan Lai (Hsinchu, TW)
Assignee: Lextar Electronics Corporation
H01L33/60H01L33/486H01L33/58H01L33/62
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Quick Facts
Patent No.
US 11,670,748
App. No.
17/195,539
Granted
Jun 6, 2023
Kind
B2
Abstract

A light emitting diode (LED) package structure includes a circuit board, a reflective cup, a LED chip and a lens structure. The reflective cup is mounted on the circuit board, wherein the reflective cup and the circuit board collectively form a concave cup with an opening. The reflective cup has a first metal ring in the concave cup. The LED chip is mounted on the circuit board and within the concave cup. The lens structure has a second metal ring configured to join the first metal ring to cover the opening.

Claims (18)

1. A light emitting diode (LED) package structure comprising:

a circuit board;

a reflective cup disposed on the circuit board, wherein the reflective cup and the circuit board collectively form a concave cup having an opening, the reflective cup has a first metal ring in the concave cup;

a LED chip disposed on the circuit board and within the concave cup; and

a lens structure having a second metal ring configured to join the first metal ring to cover the opening, wherein a bottom surface of the reflective cup has a third metal ring, and the circuit board has a fourth metal ring configured to join the third metal ring.

2. The LED package structure of claim 1 further comprising a metal paste or a glass paste disposed between the first and second metal rings, and disposed between the third and fourth metal rings.

3. The LED package structure of claim 1 further comprising a polymer adhesive disposed between the first and second metal rings, and disposed between the third and fourth metal rings.

4. The LED package structure of claim 1 , wherein the first metal ring and the third metal ring are connected to each other and have substantially the same diameter.

5. The LED package structure of claim 1 , wherein the circuit board has a stage on which the LED chip is mounted, a top of the stage is higher than an interface between the reflective cup and the circuit board.

6. The LED package structure of claim 1 , wherein the lens structure comprises a flat lens or a convex lens.

7. The LED package structure of claim 1 , wherein the lens structure is embedded in the concave cup.

8. The LED package structure of claim 1 , wherein the first, second, third and fourth metal rings are continuously closed metal rings.

9. The LED package structure of claim 1 , wherein the first, second, third and fourth metal rings are discontinuous metal rings.

10. The LED package structure of claim 1 , wherein an inner surface of the concave cup has a light reflective coating.

11. The LED package structure of claim 1 further comprising another pair of first and second metal rings with a different diameter configured to secure the lens structure to the reflective cup.

12. The LED package structure of claim 11 further comprising a polymer adhesive disposed between the another pair of first and second metal rings.

13. The LED package structure of claim 1 further comprising another pair of third and fourth metal rings with a different diameter configured to secure the reflective cup to the circuit board.

14. The LED package structure of claim 13 further comprising a polymer adhesive disposed between the another pair of third and fourth metal rings.

Assignments (2)
MERGER Recorded Mar 27, 2026
From: LEXTAR ELECTRONICS CORPORATION
To: ENNOSTAR CORPORATION
Reel/Frame 075286/0822 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 9, 2021
From: CHEN, CHANG-HAN; LIN, CHUN-PENG; LAI, LUNG-KUAN
To: LEXTAR ELECTRONICS CORPORATION
Reel/Frame 055525/0881 →