Light-emitting diode package structure
View Patent ↗A light-emitting diode (LED) package structure including an encapsulant, a carrier, and an LED chip is provided. The encapsulant has a cavity located in a front end of the encapsulant. The carrier includes a die pad, a heat spreader, and a plurality of leads. The die pad is disposed on the encapsulant and located in the cavity. The heat spreader is connected with the die pad, and passes through the encapsulant to extend outside the cavity, and further extends toward a rear end of the encapsulant. The leads pass through the encapsulant and extend outside the cavity. The LED chip is disposed on the die pad, and is electrically connected to the leads. Heat generated when the LED chip emits light is conducted to the heat spreader via the die pad, so as to conduct the heat outside the encapsulant, and to further reduce the temperature of the LED chip.
1. An LED package structure, comprising:
an encapsulant, having:
a front surface located at a front end of the encapsulant and having an opening;
a back surface opposite to the front surface;
a bottom surface connected between the front surface and the back surface; and
a cavity located in the front end of the encapsulant and communicating with the outside of the encapsulant through the opening;
a carrier, comprising:
a die pad, disposed on the encapsulant and located in the cavity;
a heat spreader, connected with the die pad, the heat spreader passing through the encapsulant and the bottom surface to extend outside the cavity and the encapsulant, and further bending and extending toward a rear end of the encapsulant opposite to the front end;
a plurality of leads, passing through the encapsulant and the bottom surface to extend outside the cavity and the encapsulant, further bending and extending toward the front end of the encapsulant, and covering a part of the bottom surface; and
an LED chip, disposed on the die pad, and electrically connected to the leads.
2. The LED package structure as claimed in claim 1 , wherein the die pad is connected to one of the leads.
3. The LED package structure as claimed in claim 1 , wherein the die pad is electrically insulated from the leads.
4. The LED package structure as claimed in claim 1 , wherein the encapsulant further has a first surface at the rear end of the encapsulant and a second surface at the rear end of the encapsulant, the back surface is opposite to a bottom surface of the cavity facing the front end, the first surface is opposite to the second surface, the back surface is connected between the first surface and the second surface, the first surface is connected between the back surface and the bottom surface of the encapsulant, and the first surface faces a portion of the heat spreader outside the encapsulant.
5. The LED package structure as claimed in claim 4 , wherein The back surface faces another portion of the heat spreader outside the encapsulant.
6. The LED package structure as claimed in claim 4 , wherein the encapsulant has a top surface opposite to the bottom surface, the top surface is connected between the front surface and the second surface, the heat spreader also passes through the top surface to extend outside the encapsulant and further bends and extends toward the rear end of the encapsulant, and the second surface faces another portion of the heat spreader outside the encapsulant.
7. The LED package structure as claimed in claim 4 , wherein the portion of the heat spreader outside the encapsulant is disposed to surround the first surface, the back surface, and the third surface; the first surface, the back surface, and the second surface face three portions of the heat spreader outside the encapsulant, respectively.
8. The LED package structure as claimed in claim 1 , wherein the LED chip is a red LED chip, a green LED chip, or a blue LED chip.
9. The LED package structure as claimed in claim 1 , further comprising at least a bonding wire, wherein at least one of the leads is electrically connected to the LED chip through the bonding wire.
10. The LED package structure as claimed in claim 1 , further comprising a transparent colloid filled in the cavity, so as to encapsulate the LED chip, a portion of the die pad, and a portion of the leads exposed by the cavity.