Pixel package, method for forming the same, and display device using the same
A pixel package is provided. The pixel package includes a flexible redistribution layer and a plurality of LED chips arranged on the surface of the flexible redistribution layer in a flip-chip manner. The pixel package also includes a plurality of light-adjusting layers respectively disposed on the LED chips. The pixel package further includes a plurality of flexible composite laminates disposed on the surface of the flexible redistribution layer and between the LED chips.
1. A pixel package, comprising:
a flexible redistribution layer;
a plurality of light-emitting diode chips arranged on a surface of the flexible redistribution layer in a flip-chip manner;
a plurality of light-adjusting layers respectively disposed on the light-emitting diode chips; and
a plurality of flexible composite laminates disposed on the surface of the flexible redistribution layer and between the light-emitting diode chips, wherein each of the flexible composite laminates comprises a flexible reflection layer disposed on the flexible redistribution layer and a flexible light-shielding layer disposed on the flexible reflection layer.
2. The pixel package as claimed in claim 1 , further comprising:
a control chip disposed on the surface of the flexible redistribution layer and covered by one of the flexible composite laminates.
3. The pixel package as claimed in claim 1 , wherein the light-emitting diode chips emit blue light or ultraviolet light.
4. The pixel package as claimed in claim 3 , wherein the light-emitting diode chips comprises a first light-emitting diode chip, a second light-emitting diode chip, and a third light-emitting diode chip respectively emitting a first light, a second light, and a third light, and wherein the light-adjusting layers comprise a first light-adjusting layer, a second light-adjusting layer, and a third light-adjusting layer respectively disposed on the first light-emitting diode chip, the second light-emitting diode chip, and the third light-emitting diode chip.
5. The pixel package as claimed in claim 4 , wherein
the first light-adjusting layer, the second light-adjusting layer, and the third light-adjusting layer respectively comprise a first light extraction layer, a second light extraction layer, and a third light extraction layer; and
the first light extraction layer, the second light extraction layer, and the third light extraction layer are respectively disposed on the first light-emitting diode chip, the second light-emitting diode chip, and the third light-emitting diode chip.
6. The pixel package as claimed in claim 5 , wherein
the first light-adjusting layer further comprises a first wavelength conversion layer on the first light extraction layer and a first filter layer on the first wavelength conversion layer, wherein the first wavelength conversion layer absorbs part of the first light and converts the first light into red light; and
the second light-adjusting layer further comprises a second wavelength conversion layer on the second light extraction layer and a second filter layer on the second wavelength conversion layer, wherein the second wavelength conversion layer absorbs part of the second light and converts the second light into green light;
wherein the first wavelength conversion layer and the second wavelength conversion layer comprise fluorescent powders, quantum dot materials, or a combination thereof.
7. The pixel package as claimed in claim 6 , wherein a top surface of the flexible reflection layer is higher than a top surface of the first wavelength conversion layer and a top surface of the second wavelength conversion layer.
8. The pixel package as claimed in claim 7 , wherein a top surface of the flexible light-shielding layer, a top surface of the first filter layer, and a top surface of the second filter layer are coplanar.
9. The pixel package as claimed in claim 7 , wherein the flexible reflection layer surrounds at least two-thirds of a thickness of the first filter layer and a thickness of the second filter layer, and the thickness of the first filter layer is calculated from a bottom surface of the first filter layer and the thickness of the second filter layer is calculated from a bottom surface of the second filter layer.
10. The pixel package as claimed in claim 9 , wherein a ratio of a thickness of the flexible light-shielding layer to the thickness of the first filter layer or to the thickness of the second filter layer is equal to or smaller than ⅓.
11. The pixel package as claimed in claim 7 , wherein a material of the flexible reflection layer comprises a reflective material and a thermosetting resin, and a material of the flexible light-shielding layer comprises a light-absorbing material and a thermosetting resin.
12. The pixel package as claimed in claim 7 , further comprising:
a transparent light extraction layer disposed on the third light extraction layer, wherein a top surface of the transparent light extraction layer, a top surface of the first filter layer, a top surface of the second filter layer, and a top surface of the flexible light-shielding layer are coplanar, and the third light-emitting diode chip emits blue light.
13. The pixel package as claimed in claim 6 , wherein the third light-adjusting layer further comprises:
a third wavelength conversion layer disposed on the third light extraction layer, wherein the third wavelength conversion layer absorbs part of the third light and converts the third light into blue light, and the third wavelength conversion comprises fluorescent powders, quantum dot materials or a combination thereof.
14. The pixel package as claimed in claim 1 , wherein the flexible redistribution layer comprises a thin insulating layer and a plurality of conductive structures, each of the conductive structures passes through the thin insulating layer from the back side of the thin insulating layer to be electrically connected to a corresponding one of the light-emitting diode chips, and a thickness of the thin insulating layer ranges from 10 to 50 μm.
15. A display device, comprising:
a circuit substrate; and
a plurality of pixel packages disposed on the circuit substrate, wherein each of the pixel packages comprises:
a flexible redistribution layer;
a plurality of light-emitting diode chips arranged on a surface of the flexible redistribution layer in a clip-chip manner;
a plurality of light-adjusting layers respectively disposed on the light-emitting diode chips; and
a plurality of flexible composite laminates disposed on the surface of the flexible redistribution layer and between light-emitting diode chips, wherein each of the flexible composite laminates comprises a flexible reflection layer disposed on the flexible redistribution layer and a flexible light-shielding layer disposed on the flexible reflection layer.