IP Library Granted Patent US 9,447,959
Granted Patent B2
US 9,447,959 · App. 14/290,971 · Granted Sep 20, 2016

Heat sink for electrical elements and light-emitting device containing thereof

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Quick Facts
Patent No.
US 9,447,959
App. No.
14/290,971
Granted
Sep 20, 2016
Kind
B2
Abstract

The disclosure provides a heat sink for electrical elements and a light-emitting device containing thereof. The heat sink includes a radiating substrate and at least one hollow radiating channel. In which, the hollow radiating channel is horizontally embedded in the radiating substrate, and has two openings disposed on the same site or the opposite sites of the radiating substrate, so that gas may flow in the hollow radiating channel and remove heat of the radiating substrate. And a light-emitting device containing the heat sink is also provided.

Claims (13)

1. A heat sink for electrical elements, comprising:

a thermal conductive substrate; and

at least one hollow ventilation channel horizontally embedded in the thermal conductive substrate, the hollow ventilation channel having a roughened surface formed on the inner wall of the hollow ventilation channel and two openings respectively on the same side or two different sides of the thermal conductive substrate, so as to flow air in the hollow ventilation channel and take away the heat of the thermal conductive substrate.

2. The heat sink of claim 1 , further comprising a composite material layer formed on the inner wall of the hollow ventilation channel.

3. The heat sink of claim 2 , wherein the composite material layer comprises a porous material or a hygroscopic material.

4. The heat sink of claim 3 , wherein the composite material layer comprises a carbonaceous material, a polymer, a metal oxide or a combination thereof.

5. The heat sink of claim 1 , wherein the material of the thermal conductive substrate includes ceramics, metals or silicon materials.

6. The heat sink of claim 5 , wherein the thermal conductive substrate is a copper substrate or a silicon substrate.

7. The heat sink of claim 1 , wherein the two different sides of the thermal conductive substrate are two opposite sides or two adjacent sides.

8. A light-emitting device, comprising:

the heat sink of claim 1 ; and

at least one light-emitting element positioned on the heat sink.

9. The light-emitting device of claim 8 , wherein the light-emitting element is a light-emitting diode.

Assignments (2)
MERGER Recorded Mar 27, 2026
From: LEXTAR ELECTRONICS CORPORATION
To: ENNOSTAR CORPORATION
Reel/Frame 075286/0822 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 5, 2014
From: YANG, LI-CHENG; LEE, YU-CHUN; KUO, CHENG-TA
To: LEXTAR ELECTRONICS CORPORATION
Reel/Frame 033035/0836 →