Surface mount type light-emitting element package device with high extraction efficiency due to gradually varying index of refraction and anti-reflective top layer
View Patent ↗The present invention discloses a surface mount type light-emitting diode package device and a light-emitting element package device. In the device, the encapsulation layer comprises an encapsulation material and at least one material having a refraction index different from the encapsulation material distributed therein. The distribution of the material having a refraction index different from the encapsulation material is in a way such that the refraction index of the encapsulation layer is gradually reduced from the bottom portion upward to the top portion or the inner portion outward to the outer portion of the encapsulation layer. Accordingly, a difference between the refraction indexes of two adjoining media can be reduced to eliminate a total reflection and the Fresnel loss and enhance light extraction efficiency.
1. A surface mount type light-emitting diode package device, comprising:
a lead frame;
at least one light-emitting diode chip disposed on the lead frame; and
a light-pervious encapsulation layer disposed on the lead frame and encapsulating the light-emitting diode chip, wherein,
the encapsulation layer has a bottom portion contacting the light-emitting diode chip and a top portion contacting an environmental ambiance,
the encapsulation layer comprises at least one encapsulation material and at least one material,
the at least one material has a refraction index different from the encapsulation material and is distributed in the encapsulation material in a way such that the refraction index of the encapsulation layer is gradually reduced from the bottom portion upward to the top portion of the encapsulation layer, and
the distribution density of the at least one material present in a surface structure of a top surface of the encapsulation layer is higher than the distribution density of the at least one material present in the portion of the encapsulation layer immediately therebeneath.
2. The surface mount type light-emitting diode package device of claim 1 , wherein the bottom portion of the encapsulation layer has a refraction index close to the refraction index of the topmost layer of the light-emitting diode chip.
3. The surface mount type light-emitting diode package device of claim 1 , wherein the top portion of the encapsulation layer has a refraction index close to the refraction index of the environmental ambiance.
4. The surface mount type light-emitting diode package device of claim 1 , wherein, the encapsulation layer comprises a plurality of encapsulation materials and the at least one material, the at least one material has a refraction index different from the refraction indexes of the encapsulation materials, and the at least one material is distributed in the encapsulation materials.
5. The surface mount type light-emitting diode package device of claim 1 , wherein the at least one material is distributed in the at least one encapsulation material with a high distribution density at the bottom portion of the encapsulation layer and gradually reduced to a low distribution density upward to the top portion of the encapsulation layer.
6. The surface mount type light-emitting diode package device of claim 1 , wherein the encapsulation layer comprises a plurality of the at least one materials having refraction indexes different from the at least one encapsulation material and different from each other.