Light-emitting diode module and lamp using the same
View Patent ↗A light-emitting diode (LED) module and a lamp using the same are provided. The LED module includes a substrate and several light-emitting packages. Each light-emitting package includes an optical wavelength conversion layer and a light-emitting diode having a first light-output surface, a bonding surface, and several second light-output surfaces. The bonding surface is opposite the first light-output surface and connected to the substrate. The second light-output surfaces are between the first light-output surface and the bonding surface. The optical wavelength conversion layer covers the first and second light-output surfaces. The distance between the bonding surface and the top surface of the optical wavelength conversion layer represents a light source thickness. The distance between two adjacent light-emitting packages represents a spacing of light sources. Specifically, the ratio of the spacing of light sources to the light source thickness is between 1 and 6.3.
1. A light-emitting diode (LED) module, comprising:
a substrate; and
a plurality of light-emitting packages, each of the light-emitting packages including an optical wavelength conversion layer and a light-emitting diode (LED) having a first light-output surface, a bonding surface and a plurality of second light-output surfaces, wherein the bonding surface is opposite the first light-output surface and connected to the substrate by a flip-chip packaging, the second light-output surfaces are between and substantially perpendicular to the first light-output surface and the bonding surface, and the optical wavelength conversion layer is disposed on the LED and covers the first light-output surface and the second light-output surfaces thereof, wherein a distance between the bonding surface of the LED and a top surface of the optical wavelength conversion layer on the first light-output surface represents a light source thickness, and another distance between two adjacent light-emitting packages represents a spacing of light sources, wherein a ratio of the spacing of light sources to the light source thickness is between 1 and 6.3.
2. The LED module as claimed in claim 1 , wherein the ratio of the spacing of light sources to the light source thickness is between 2 and 3.
3. The LED module as claimed in claim 1 , wherein the bonding surface of the LED has a plurality of electrodes thereon, and the substrate has a plurality of bonding pads thereon corresponding to the electrodes, so as to electrically connect the LED and the substrate.
4. The LED module as claimed in claim 3 , wherein one of the electrodes of the LED has a first area, and a corresponding bonding pad on the substrate has a second area, wherein a ratio of the first area to the second area is between 0.5 and 2.
5. The LED module as claimed in claim 3 , wherein one of the bonding pads on the substrate is shifted with respect to a corresponding electrode of the LED along a horizontal direction by a distance that is less than 50 micrometers.
6. The LED module as claimed in claim 1 , wherein the optical wavelength conversion layer on the first light-output surface has a first thickness, and the optical wavelength conversion layer on the second light-output surfaces has a second thickness, wherein a ratio of the first thickness to the second thickness is between 1 and 1.33.
7. The LED module as claimed in claim 1 , further comprising:
a light-guide layer, disposed between the light-emitting packages.
8. The LED module as claimed in claim 7 , wherein the light-guide layer has a refractive index that is less than that of the optical wavelength conversion layers.
9. The LED module as claimed in claim 7 , wherein the light-guide layer has a bottom surface and a second top surface, the bottom surface is opposite the second top surface and connected to the substrate, and the second top surface is a flat surface, a convex curved surface, a concave curved surface, or a serrated surface.
10. A lamp, comprising:
a base;
a light cover, connected to the base for forming a receiving space; and
a light-emitting diode (LED) module, disposed in the receiving space, comprising:
a substrate; and
a plurality of light-emitting packages, each of the light-emitting packages including an optical wavelength conversion layer and a light-emitting diode (LED) having a first light-output surface, a bonding surface and a plurality of second light-output surfaces, wherein the bonding surface is opposite the first light-output surface and connected to the substrate by a flip-chip packaging, the second light-output surfaces are between and substantially perpendicular to the first light-output surface and the bonding surface, and the optical wavelength conversion layer is disposed on the LED and covers the first light-output surface and the second light-output surfaces, wherein a distance between the bonding surface of the LED and a top surface of the optical wavelength conversion layer on the first light-output surface represents a light source thickness, and another distance between two adjacent light-emitting packages represents a spacing of light sources, wherein a ratio of the spacing of light sources to the light source thickness is between 1 and 6.3.
11. The LED module as claimed in claim 1 , further comprising:
a light-guide layer, disposed between the light-emitting packages, wherein the light-guide layer does not extend onto the top surface of the optical wavelength conversion layer of each light-emitting package.
12. The lamp as claimed in claim 10 , further comprising:
a light-guide layer, disposed between the light-emitting packages, wherein the light-guide layer does not extend onto the top surface of the optical wavelength conversion layer of each light-emitting package.