IP Library Granted Patent US 9,166,128
Granted Patent B2
US 9,166,128 · App. 14/251,534 · Granted Oct 20, 2015

Light-emitting assembly and method for manufacturing the same

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Quick Facts
Patent No.
US 9,166,128
App. No.
14/251,534
Granted
Oct 20, 2015
Kind
B2
Abstract

A light-emitting assembly and a method for manufacturing the same are provided. The light-emitting assembly includes a circuit board with a light-emitting element and a plurality of optical microstructures disposed thereon. The optical microstructures adjacent to the light-emitting element absorb or guide a portion of light emitted from the light-emitting element.

Claims (17)

1. A method for manufacturing a light-emitting assembly, comprising:

providing a circuit board;

forming a plurality of optical microstructures on the circuit board; and

providing a light-emitting element on the circuit board, wherein the optical microstructures are adjacent to the light-emitting element for absorbing or guiding a portion of light emitted from the light-emitting element, and the optical microstructures are made from an ink comprising light-absorbing or light reflecting material.

2. The method for manufacturing a light-emitting assembly as claimed in claim 1 , wherein the steps of forming the optical microstructures comprise:

providing a screen component;

providing the ink, and disposing the ink on the circuit board through the screen component to form a plurality of ink microstructures; and

curing the ink microstructures to form the plurality of solid optical microstructures on the circuit board.

3. The method for manufacturing a light-emitting assembly as claimed in claim 2 , wherein the optical microstructures are formed in a region where the light emitted from the light-emitting element is predicted to have a higher density and form a bright band.

4. The method for manufacturing a light-emitting assembly as claimed in claim 1 , wherein the ink comprises silica gel, acrylic, epoxy resin, or a combination thereof.

5. The method for manufacturing a light-emitting assembly as claimed in claim 1 , wherein the light-absorbing material comprises organic or mineral dye.

6. The method for manufacturing a light-emitting assembly as claimed in claim 5 , wherein the light-absorbing material comprises carbon black and/or black mineral dye.

7. The method for manufacturing a light-emitting assembly as claimed in claim 1 , wherein the light-reflecting material comprises high reflective oxide and/or high reflective metal.

8. The method for manufacturing a light-emitting assembly as claimed in claim 7 , wherein the light-reflecting materials comprise titanium dioxide, aluminum, and/or silver.

9. The method for manufacturing a light-emitting assembly as claimed in claim 1 , wherein the light-emitting element comprises an LED.

10. The method for manufacturing a light-emitting assembly as claimed in claim 9 , further comprising:

providing a lens covering the light-emitting element.

Assignments (2)
MERGER Recorded Mar 27, 2026
From: LEXTAR ELECTRONICS CORPORATION
To: ENNOSTAR CORPORATION
Reel/Frame 075286/0822 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 20, 2014
From: HO, YEI-HOW
To: LEXTAR ELECTRONICS CORPORATION
Reel/Frame 032713/0408 →