LED CHIP CONFIGURATION METHOD
An LED chip configuration method is provided, comprising forming a plurality of LED chips from a wafer wherein the plurality of LED chips having the same color and different wavelengths; binning the plurality of LED chips into a first group having a minimum wavelength range, a second group having a first middle wavelength range, and a third group having a maximum wavelength range wherein the minimum wavelength range, the first middle wavelength range, and the maximum wavelength range are not overlapped with each other; providing a substrate; and disposing LED chips from the first group, the second group, and the third group on the substrate; wherein the disposed LED chips from different groups are arranged in a staggered manner.
1 . An LED chip configuration method, comprising:
forming a plurality of LED chips from a wafer wherein the plurality of LED chips having the same color and different wavelengths;
binning the plurality of LED chips into a first group having a minimum wavelength range, a second group having a first middle wavelength range, and a third group having a maximum wavelength range wherein the minimum wavelength range, the first middle wavelength range, and the maximum wavelength range are not overlapped with each other;
providing a substrate; and
disposing LED chips from the first group, the second group, and the third group on the substrate;
wherein the disposed LED chips from different groups are arranged in a staggered manner.
2 . The LED chip configuration method as claimed in claim 1 , wherein the binning step further comprising binning the plurality of LED chips into groups according to a wavelength interval.
3 . The LED chip configuration method as claimed in claim 1 , wherein the wavelength ranges of the LED chips in the different groups are different.
4 . The LED chip configuration method as claimed in claim 1 , wherein the LED chip from the first group is not adjacent to the LED chip from the third group.
5 . The LED chip configuration method as claimed in claim 1 , wherein the LED chips from the same group are not adjacent to each other.
6 . The LED chip configuration method as claimed in claim 1 , wherein the binning step further comprising binning the plurality of LED chips into a fourth group having a second middle wavelength range, the LED chip from the second group is disposed adjacent to the LED chip from the fourth group.
7 . The LED chip configuration method as claimed in claim 1 , wherein the total wavelength range of the three groups is from 4 nm to 12 nm.
8 . The LED chip configuration method as claimed in claim 1 , wherein each of the LED chips is packaged by a transparent encapsulant.
9 . The LED chip configuration method as claimed in claim 8 , wherein the transparent encapsulant further includes a wavelength conversion material.
10 . The LED chip configuration method as claimed in claim 1 , where the plurality of LED chips are blue LED chips.