Light-emitting diode package structure, cold cathode flourescent lamp and photoluminescent material thereof
View Patent ↗An LED package structure including a carrier, an LED chip, an encapsulant and a PL material is provided, wherein the LED chip is disposed on the carrier for emitting light. The encapsulant encapsulates the LED chip. The PL material is distributed in the encapsulant. The PL material is suitable for being excited by the light emitted from the LED chip and scattering the light. Moreover, the present invention provides a novel PL material with a molecular formula of W m Mo n (Y,Ce,Tb,Gd,Sc) 3+t+u (Al,Ga,Tl,In,B) 5+u+2v (O,S,Se) 12+2t+3u+3v+3m+3n : Ce 3+ , Tb 3+ , wherein 0<t<5 and 0<m, n, u, v<15.
1. A light-emitting diode (LED) package structure, comprising:
a carrier;
an LED chip disposed on the carrier and suitable for emitting light;
an encapsulant for encapsulating the LED chip on the carrier, and
a photoluminescent material distributed in the encapsulant, wherein the molecular formula of the photoluminescent material is given by:
W m Mo n (Y,Ce,Tb,Gd,Sc) 3+t+u (Al,Ga,Tl,In,B) 5+u+2v (O,S,Se) 12+2t+3u+3v+3m+3n : Ce 3+ , Tb 3+ , wherein 0<t<5 and 0<m, n, u, v<15.
2. The LED package structure of claim 1 , wherein the carrier is a printed circuit board (PCB) and the LED chip is electrically connected to the PCB.
3. The LED package structure of claim 2 , wherein there is a chip-holding cell on the PCB suitable for holding the LED chip.
4. The LED package structure of claim 1 , wherein the carrier is a package frame electrically connected to the LED chip.
5. The LED package structure of claim 4 , further comprising two soldering wires electrically connected between the LED chip and the package frame.
6. The LED package structure of claim 1 , wherein the LED chip is a blue LED chip.
7. The LED package structure of claim 1 , wherein the encapsulant comprises:
an inner encapsulant for encapsulating the LED chip, wherein the photoluminescent material are distributed; and
an outer encapsulant for encapsulating the inner encapsulant and a portion of the carrier.
8. The LED package structure of claim 1 , wherein the photoluminescent material with the molecular formula of
W m Mo n (Y,Ce,Tb,Gd,Sc) 3+t+u (Al,Ga,Tl,In,B) 5+u+2v (O,S,Se) 12+2t+3u+3v+3m : Ce 3+ , Tb 3+ , wherein 0<t<5 and 0<m, n, u, v<15, is a mixture.
9. The LED package structure of claim 1 , wherein the photoluminescent material with the molecular formula of
W m Mo n (Y,Ce,Tb,Gd,Sc) 3+t+u (Al,Ga,Tl,In,B) 5+u+2v (O,S,Se) 12+2t+3u+3v+3m+3n : Ce 3+ , Tb 3+ , wherein 0<t<5 and 0<m, n, u, v<15,is a sinter.
10. The LED package structure of claim 1 , wherein the largest particle diameter of the photoluminescent material is smaller than 30 microns and the average particle diameter thereof is smaller than 10 microns.
11. The LED package structure of claim 1 , wherein the photoluminescent material comprises a fluorescent material and a diffusion material adhering to the fluorescent material.
12. The LED package structure of claim 11 , wherein the particle diameter of the fluorescent material is smaller than 25 microns.