Light emitting diode package
A light emitting diode (LED) package includes a carrier, an LED chip, an encapsulant, a plurality of phosphor particles, and a plurality of anti-humidity particles. The LED chip is disposed on and electrically connected to the carrier. The encapsulant encapsulates the LED chip. The phosphor particles and the anti-humidity particles are distributed within the encapsulant. A first light emitted from the LED chip excites the phosphor particles to emit a second light. Some of the anti-humidity particles are adhered onto a surface of the phosphor particles, while the other anti-humidity particles are not adhered onto the surface of the phosphor particles. The anti-humidity particles absorb H 2 O so as to avoid H 2 O from being reacted with the phosphor particles. The LED package of the present application has favorable water resistance.
1. A light emitting diode package, comprising:
a carrier;
a light emitting diode chip disposed on and electrically connected to the carrier;
an encapsulant encapsulating the light emitting diode chip;
a plurality of phosphor particles; and
a plurality of anti-humidity particles, wherein the phosphor particles and the anti-humidity particles are distributed within the encapsulant, a first light emitted from the light emitting diode chip excites the phosphor particles to emit a second light, parts of the anti-humidity particles are adhered onto a surface of the phosphor particles, and the other anti-humidity particles are not adhered onto the surface of the phosphor particles.
2. The light emitting diode package as claimed in claim 1 , wherein the carrier comprises a circuit board or a leadframe.
3. The light emitting diode package as claimed in claim 1 , wherein the light emitting diode chip is a blue light emitting diode chip, and the phosphor particles comprise yellow phosphor particles.
4. The light emitting diode package as claimed in claim 1 , wherein the light emitting diode chip is an ultraviolet light emitting diode chip, and the phosphor particles comprise red phosphor particles, green phosphor particles, blue phosphor particles, or a combination thereof.
5. The light emitting diode package as claimed in claim 1 , wherein the encapsulant is a transparent encapsulant.
6. The light emitting diode package as claimed in claim 1 , wherein a material of the anti-humidity particles comprises inorganic hydrophilic oxide.
7. The light emitting diode package as claimed in claim 6 , wherein a material of the inorganic hydrophilic oxide comprises silicon oxide, aluminum oxide, titanium oxide, zirconium oxide, zinc oxide, germanium oxide, gallium oxide, indium oxide, tin oxide, or tantalum oxide.
8. The light emitting diode package as claimed in claim 1 , wherein a material of the anti-humidity particles comprises an organic polymer material having a hydrophilic functional group.
9. The light emitting diode package as claimed in claim 1 , wherein a particle diameter of the phosphor particles ranges from 1 μm to 100 μm.
10. The light emitting diode package as claimed in claim 1 , wherein a particle diameter of the anti-humidity particles ranges from 1 nm to 100 nm.
11. The light emitting diode package as claimed in claim 1 , wherein the phosphor particles and the anti-humidity particles are concentratively distributed around the light emitting diode chip.
12. The light emitting diode package as claimed in claim 1 , wherein the phosphor particles and parts of the anti-humidity particles are concentratively distributed around the light emitting diode chip, and parts of the anti-humidity particles which are not adhered onto the phosphor particles are randomly distributed within the encapsulant.
13. The light emitting diode package as claimed in claim 1 , wherein the phosphor particles and the anti-humidity particles are randomly distributed within the encapsulant.
14. The light emitting diode package as claimed in claim 1 , wherein each of the phosphor particles is not completely enclosed by the anti-humidity particles.