IP Library Granted Patent US 12,284,853
Granted Patent B2
US 12,284,853 · App. 18/393,602 · Granted Apr 22, 2025

LED package structure

Inventor: Chien-Hsin Tu (Hsinchu, TW)
Assignee: Lextar Electronics Corporation
H10H20/855H10H20/8506H10H20/851
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Quick Facts
Patent No.
US 12,284,853
App. No.
18/393,602
Granted
Apr 22, 2025
Kind
B2
Abstract

A light emitting diode (LED) package structure include an electrically-insulated frame, a trough, a LED chip, a fluorescent colloid and at least two spacing members. The electrically-insulated frame has a surface with four corners. The trough is recessed in the surface. The LED chip is located in the trough. The fluorescent colloid is filled within the trough to cover the LED chip. The spacing members protrude from two of the four corners on the surface, wherein a glue escape gap is defined between each spacing member and a boundary of the trough.

Claims (28)

1. A light emitting diode (LED) package structure comprising:

an electrically-insulated frame having a surface, wherein the surface has four corners;

a trough recessed in the surface;

an LED chip disposed in the trough;

a fluorescent colloid filled within the trough and covering the LED chip; and

at least two spacing members protruding from two of the four corners on the surface, wherein one of the four corners is a location-recognized corner, and the at least two spacing members are located at remaining corners of the four corners except the location-recognized corner.

2. The LED package structure of claim 1 , wherein the at least two spacing members have a same height.

3. The LED package structure of claim 1 , wherein the surface is a rectangle, and the at least two spacing members are located at a pair of corners of the rectangle.

4. The LED package structure of claim 1 , wherein each spacing member comprises a triangular column.

5. The LED package structure of claim 1 , wherein each spacing member comprises a hemisphere.

6. The LED package structure of claim 1 , wherein each spacing member comprises a long bar.

7. The LED package structure of claim 1 , wherein each spacing member comprises a pyramid.

8. A light emitting module comprising:

a light guide plate; and

a light emitting diode (LED) package structure disposed adjacent to a sidewall of the light guide plate, wherein the LED package structure comprises:

an electrically-insulated frame having a surface, wherein the surface has four corners;

a trough recessed in the surface;

an LED chip disposed in the trough;

a fluorescent colloid filled within the trough and covering the LED chip; and

at least two spacing members protruding from two of the four corners on the surface,

wherein the at least two spacing members are in contact with the sidewall of the light guide plate,

wherein one of the four corners is a location-recognized corner, and the at least two spacing members are located at remaining corners of the four corners except the location-recognized corner.

9. The light emitting module of claim 8 , wherein the at least two spacing members have a same height.

10. The light emitting module of claim 8 , wherein the surface is a rectangle, and the at least two spacing members are located at a pair of corners of the rectangle.

11. The light emitting module of claim 8 , wherein each spacing member comprises a triangular column.

12. The light emitting module of claim 8 , wherein each spacing member comprises a hemisphere.

13. The light emitting module of claim 8 , wherein each spacing member comprises a long bar.

14. The light emitting module of claim 8 , wherein each spacing member comprises a pyramid.

Assignments (2)
MERGER Recorded Mar 27, 2026
From: LEXTAR ELECTRONICS CORPORATION
To: ENNOSTAR CORPORATION
Reel/Frame 075286/0822 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 26, 2023
From: TU, CHIEN-HSIN
To: LEXTAR ELECTRONICS CORPORATION
Reel/Frame 065950/0212 →
Priority Claims (1)
CN 202011201328.1 · Nov 2, 2020 · national
Continuity (2)
Continuation 17386561 · Jul 28, 2021
Related Publication 20240136483A1 · Apr 25, 2024
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