Method for manufacturing light emitting diode packaging structure
A method for manufacturing a light emitting diode packaging structure includes the operations below. A flexible substrate having a first surface and a second surface is provided. A carrier substrate is formed on the first surface. An adhesive layer is formed on the second surface. A micro light emitting element is formed on the adhesive layer. The micro light emitting element has a conductive pad thereon opposite to the adhesive layer. A redistribution layer is formed and covers the micro light emitting element and the adhesive layer, wherein the redistribution layer includes a circuit layer electrically connecting to the conductive pad and an insulating layer covering the circuit layer. An electrode pad is formed on the redistribution layer and electrically connected to the circuit layer, wherein a total thickness of the flexible substrate, the adhesive layer, the redistribution layer, and the electrode pad is less than 200 um.
1. A method for manufacturing a light emitting diode packaging structure, comprising: providing a flexible substrate having a first surface and a second surface opposite thereof; forming a carrier substrate on the first surface; forming an adhesive layer on the second surface; forming a micro light emitting element on the adhesive layer, wherein the micro light emitting element has a conductive pad thereon opposite to the adhesive layer; forming a redistribution layer covering the micro light emitting element and the adhesive layer, wherein the redistribution layer comprises a circuit layer electrically connecting to the conductive pad and an insulating layer covering the circuit layer; and forming an electrode pad on the redistribution layer and electrically connecting to the circuit layer, wherein a total thickness of the flexible substrate, the adhesive layer, the redistribution layer, and the electrode pad is less than 200 μm.
2. The method of claim 1 , further comprising:
after forming the electrode pad, removing the carrier substrate; and
dicing the flexible substrate along a scribe line to form a plurality of light emitting diode packaging structures.
3. The method of claim 2 , further comprising:
after removing the carrier substrate, texturing the first surface of the flexible substrate.
4. The method of claim 3 , wherein the first surface of the flexible substrate of each of the light emitting diode packaging structures is an uneven surface.
5. The method of claim 2 , further comprising:
forming a microstructure on the first surface of the flexible substrate.
6. The method of claim 5 , wherein the microstructure comprises an optical lens, an optical coating layer, or an optical film.
7. The method of claim 2 , further comprising:
after removing the carrier substrate, flattening the first surface of the flexible substrate.
8. The method of claim 1 , further comprising:
after forming the electrode pad, dicing the flexible substrate along a scribe line to form a plurality of light emitting diode packaging structures.
9. The method of claim 1 , further comprising:
before forming the electrode pad and after forming the redistribution layer, forming a conductive via in the redistribution layer so that the conductive via electrically connects the electrode pad to the circuit layer.
10. The method of claim 1 , wherein the flexible substrate comprises polyimide, polyethylene terephthalate, poly(ethylene naphthalate), polycarbonate, glass or a combination thereof.
11. The method of claim 1 , further comprising:
forming an alignment mark on the carrier substrate.
12. The method of claim 1 , wherein a portion of the circuit layer is in direct contact with the adhesive layer.