PACKAGE STRUCTURE
A package structure is provided. The package structure includes multiple lead frames. Each lead frame has a recess and a die-bonding surface. The package structure also includes an insulating portion that covers the lead frames and fills the recesses of the lead frames. The insulating portion also fills the space between the lead frames. The insulating portion defines an accommodation space and has multiple openings that expose the die-bonding surfaces of the lead frames. The package structure further includes an optoelectronic element and an encapsulant. The optoelectronic element is disposed within the accommodation space and is electrically connected to the die-bonding surfaces of the lead frames, and the encapsulant is disposed within the accommodation space and covers the optoelectronic element.
1 . A package structure, comprising:
a base, comprising:
a plurality of lead frames, wherein each of the lead frames has a recess and a die-bonding surface; and
an insulating portion covering the lead frames and filling the recesses of the lead frames and a space between the lead frames, wherein the insulating portion defines an accommodation space and has a plurality of openings that expose the die-bonding surfaces of the lead frames;
an optoelectronic element disposed within the accommodation space and electrically connected to the die-bonding surfaces of the lead frames; and
an encapsulant disposed within the accommodation space and covering the optoelectronic element.
2 . The package structure as claimed in claim 1 , wherein the die-bonding surfaces of the lead frames are within an orthogonal projection of the optoelectronic element on the lead frames.
3 . The package structure as claimed in claim 1 , wherein a depth of the recess is between ⅓ to ½ of a thickness of each of the lead frames.
4 . The package structure as claimed in claim 1 , wherein the insulating portion comprises a plurality of connecting surfaces respectively adjacent to the corresponding one of the openings.
5 . The package structure as claimed in claim 4 , wherein in a top view, one of the connecting surfaces surrounds one of the die-bonding surfaces exposed by the corresponding one of the openings.
6 . The package structure as claimed in claim 5 , wherein a top view shape of the one of the connecting surfaces is conformal with that of the one of the die-bonding surfaces.
7 . The package structure as claimed in claim 4 , wherein in a cross-sectional view, at least one of the connecting surfaces is coplanar with one of the die-bonding surfaces exposed by the corresponding one of the openings.
8 . The package structure as claimed in claim 4 , wherein in a cross-sectional view, one of the connecting surfaces is a flat plane.
9 . The package structure as claimed in claim 4 , wherein in a cross-sectional view, the insulating portion comprises a protruding surface between two adjacent connecting surfaces.
10 . The package structure as claimed in claim 9 , wherein in the cross-sectional view, a total width of the two adjacent connecting surfaces and the protruding surface therebetween in a horizontal direction is less than or equal to a distance between two adjacent die-bonding surfaces.
11 . The package structure as claimed in claim 1 , wherein in a cross-sectional view, the insulating portion comprises a protruding surface between two adjacent die-bonding surfaces.
12 . The package structure as claimed in claim 11 , wherein in the cross-sectional view, the protruding surface is higher than the die-bonding surfaces.
13 . The package structure as claimed in claim 11 , wherein in the cross-sectional view, the protruding surface has a dome shape.
14 . The package structure as claimed in claim 11 , wherein in the cross-sectional view, the insulating portion comprises a connecting surface between the protruding surface and one of the two adjacent die-bonding surfaces.
15 . The package structure as claimed in claim 14 , wherein the protruding surface is connected to the one of the two adjacent die-bonding surfaces via the connecting surface therebetween.
16 . The package structure as claimed in claim 14 , wherein in the cross-sectional view, the connecting surface is lower than the protruding surface.
17 . The package structure as claimed in claim 11 , wherein the optoelectronic element comprises a semiconductor stack and a plurality of electrodes, and the electrodes are on the same side of the semiconductor stack and connected to the die-bonding surfaces of the lead frames via a plurality of conductive elements.
18 . The package structure as claimed in claim 17 , wherein a ratio of a distance between the highest point of the protruding surface and one of the die-bonding surfaces in a vertical direction to a thickness of one of the conductive elements in the vertical direction is between ⅓ and 1.
19 . The package structure as claimed in claim 1 , wherein one of the recesses has a smooth surface.
20 . The package structure as claimed in claim 1 , wherein one of the die-bonding surfaces is an island-shaped conductive plane.