Light-emitting diode package

1. A light-emitting diode package comprising:

a substrate;

at least one light-emitting chip disposed on the substrate;

a light-reflective layer disposed around the light-emitting chip; and

a wave-length conversion fluorescent layer disposed over the light-emitting chip, wherein the light-reflective layer is spaced from the fluorescent wave-length conversion layer by at least one groove of which the light-reflective layer and the fluorescent wave-length coversion layer define two opposite sidewalls, the at least one groove reaches two opposite sides of the light-emitting diode package.

2. The light-emitting diode package of claim 1 , wherein a thermal expansion coefficient of the light-reflective layer is different from that of the wave-length conversion fluorescent layer.

3. The light-emitting diode package of claim 1 , wherein the groove has a width ranging from 0.05 millimeter to 0.5 millimeter.

4. The light-emitting diode package of claim 1 , wherein the at least one groove comprises plural grooves formed between each edge of the wave-length conversion fluorescent layer and the light-reflective layer respectively.

5. The light-emitting diode package of claim 4 , wherein any immediately-adjacent two of the plural grooves are intersected.

6. The light-emitting diode package of claim 4 , wherein any opposite two of the plural grooves are in parallel with each other.

7. The light-emitting diode package of claim 1 , wherein the at least one light-emitting chip is electrically coupled to the substrate by a flip-chip manner.

8. The light-emitting diode package of claim 1 , wherein a top surface of the wave-length conversion fluorescent layer is level with a top surface of the light-reflective layer.