LIGHT SOURCE MODULE AND MANUFACTURING METHOD THEREOF
A light source module is provided. The light source module includes a substrate, a light source and a packaging material. The light source is disposed on the substrate, wherein the light source comprises a top surface and a lateral surface. The packaging material is disposed on the substrate and covers the light source, wherein a recess is formed on the packaging material, and the recess corresponds to the top surface.
1 . A method for manufacturing a light source module, comprising:
providing a substrate and a plurality of light sources, wherein the light sources are disposed on the substrate;
providing a packaging material, wherein the packaging material is disposed on the substrate and covers the light sources; and
forming a plurality of recesses on the packaging material by imprinting, wherein the recesses correspond to the light sources.
2 . The method as claimed in claim 1 , wherein in the imprinting process, the packaging material is in a non-fully solidified state (B-stage).
3 . The method as claimed in claim 1 , wherein the recesses are imprinted by a mold, and the hardness of the mold is greater than the hardness of the packaging material when the packaging material is imprinted.
4 . A light source module, comprising:
a substrate;
a light source, disposed on the substrate, wherein the light source comprises a top surface and a lateral surface; and
a packaging material, disposed on the substrate and covering the light source, wherein a recess is formed on the packaging material, and the recess corresponds to the top surface.
5 . The light source module as claimed in claim 4 , wherein the light source comprises a chip scale package.
6 . The light source module as claimed in claim 4 , wherein the light source comprises a blue light chip.
7 . The light source module as claimed in claim 5 , further comprising a reflective layer, wherein the reflective layer fills the recess.
8 . The light source module as claimed in claim 6 , further comprising a wavelength conversion material, wherein the wavelength conversion material fills the recess, and the wavelength conversion material comprises quantum dot material, sulfide or phosphor.
9 . The light source module as claimed in claim 8 , further comprising a waterproof material, wherein the waterproof material covers the packaging material.
10 . The light source module as claimed in claim 9 , wherein the waterproof material comprises a transparent portion and a reflective portion, the transparent portion covers the wavelength conversion material, and the reflective portion surrounds the sides of the packaging material.