Light emitting diode package

1. A light emitting diode package, comprising:

a light element;

a packaging cup for accommodating the light element, the packaging cup having an opening;

a light transferring layer disposed on the packaging cup and sealing the opening to define a closed space therebetween, the light transferring layer having a light outlet face, a light inlet side opposite to the light outlet face and a peripheral side, and the light inlet face facing to the light element;

a packaging layer enclosing the light transferring layer, the packaging layer covering the light outlet face, the light inlet face and the peripheral side of the light transferring layer;

a white wall disposed on the packaging cup and surrounding the packaging layer corresponding to the peripheral side of the light transferring layer, the white wall having a thickness the same as a combined thickness of the packaging layer and the light transferring layer; and

a diffusion film disposed on the packaging layer and white wall.

2. The light emitting diode package of claim 1 , wherein the packaging layer covers the light inlet face of the light transferring layer.

3. The light emitting diode package of claim 2 , wherein the white wall surrounds the packaging layer and the peripheral side of the light transferring layer.

4. The light emitting diode package of claim 1 , wherein the light transferring layer comprises quantum dots (QDs) light emitting material.

5. The light emitting diode package of claim 1 , wherein a material of the white wall is selected from glass, quartz, light reflection film, plastic polymer and a combination thereof.

6. The light emitting diode package of claim 1 , wherein the light element is a light emitting diode.

7. The light emitting diode package of claim 6 , wherein the light emitting diode is chips on board (COB) or plastic leaded chip carrier (PLCC).