Patent Assignment
Reel/Frame 057470/0111
Assignment of Assignor's Interest
Recorded: 2021-09-14
Pages: 6
Assignors
LEE, JIN-SU
Executed: 2021-04-28
CHAE, HONG SIK
Executed: 2021-04-28
KIM, YOUN SOO
Executed: 2021-05-11
KIM, TAE KYUN
Executed: 2021-04-28
CHO, YOUN JOUNG
Executed: 2021-09-06
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device and Method for Fabricating Thereof