Patent Assignment
Reel/Frame 057481/0467
Assignment of Assignor's Interest
Recorded: 2021-09-14
Pages: 6
Assignors
LEE, EUI BOK
Executed: 2021-08-30
KIM, WAN DON
Executed: 2021-08-30
LEE, HYUN BAE
Executed: 2021-08-30
HWANG, YOON TAE
Executed: 2021-08-30
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Devices Having Highly Integrated Active and Power Distribution Regions Therein