IP Library › Assignment 057482/0700
Patent Assignment
Reel/Frame 057482/0700

Assignment of Assignor's Interest

Recorded: 2021-09-15 Pages: 4
Assignors
LAI, YEN-KUN
Executed: 2021-01-17
HSU, CHIEN-HAO
Executed: 2021-01-17
TU, WEI-HSIANG
Executed: 2021-01-17
CHANG, KUO-CHIN
Executed: 2021-01-17
LII, MIRNG-JI
Executed: 2021-01-17
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property (1)
Semiconductor Die
Application: 17/461,952 →
Publication: US 2023/0060249