Patent Assignment
Reel/Frame 057482/0876
Assignment of Assignor's Interest
Recorded: 2021-09-15
Pages: 4
Assignors
CHEN, CHIH-HAO
Executed: 2021-05-19
CHENG, PO-YUAN
Executed: 2021-05-23
WANG, PU
Executed: 2021-05-19
CHENG, LI-HUI
Executed: 2021-05-23
LU, SZU-WEI
Executed: 2021-05-19
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Package Structure and Manufacturing Method Thereof