Patent Assignment
Reel/Frame 057482/0880
Assignment of Assignor's Interest
Recorded: 2021-09-15
Pages: 3
Assignors
CHANG, WEI-CHUNG
Executed: 2021-05-25
HO, MING-CHE
Executed: 2021-05-25
KUO, HUNG-JUI
Executed: 2021-05-25
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Package Having Composite Seed-Barrier Layer Lining Through Holes and Manufacturing Method Thereof