Patent Assignment
Reel/Frame 057494/0087
Assignment of Assignor's Interest
Recorded: 2021-09-15
Pages: 6
Assignee
KOKUSAI ELECTRIC CORPORATION
3-4, KANDAKAJI-CHO, CHIYODA-KU, TOKYO, 101-0045, JAPAN
Covered Property
(1)
Method of Manufacturing Semiconductor Device, Substrate Processing Apparatus, Method of Processing Substrate, and Recording Medium