Patent Assignment
Reel/Frame 057495/0830
Assignment of Assignor's Interest
Recorded: 2021-09-15
Pages: 4
Assignors
LIN, PO-YAO
Executed: 2020-12-23
YEH, SHU-SHEN
Executed: 2020-12-23
WANG, CHIN-HUA
Executed: 2020-12-24
LIN, YU-SHENG
Executed: 2020-12-23
JENG, SHIN-PUU
Executed: 2020-12-23
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Package Structure and Method of Forming the Same