Patent Assignment
Reel/Frame 057496/0181
Assignment of Assignor's Interest
Recorded: 2021-09-16
Pages: 3
Assignors
TANG, TZU-CHUN
Executed: 2021-07-27
TSAI, CHUNG-HAO
Executed: 2021-07-22
WANG, CHUEI-TANG
Executed: 2021-08-01
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Package and Method of Manufacturing the Same