Patent Assignment
Reel/Frame 057509/0209
Assignment of Assignor's Interest
Recorded: 2021-09-17
Pages: 4
Assignors
YU, JEN-JUI
Executed: 2020-12-17
PEI, HAO-JAN
Executed: 2020-12-18
CHEN, CHENG-TING
Executed: 2020-12-20
TSAO, CHIH-CHIANG
Executed: 2020-12-17
LIN, HSIU-JEN
Executed: 2020-12-31
HSIEH, CHING-HUA
Executed: 2020-12-14
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Package Structure and Method of Forming the Same