IP Library › Assignment 057509/0216
Patent Assignment
Reel/Frame 057509/0216

Assignment of Assignor's Interest

Recorded: 2021-09-17 Pages: 3
Assignors
CHEN, HSIEN-WEI
Executed: 2021-01-26
CHEN, MING-FA
Executed: 2021-02-21
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property (1)
Semiconductor Structure and Semiconductor Die
Application: 17/462,021 →
Publication: US 2023/0063539