Patent Assignment
Reel/Frame 057514/0650
Assignment of Assignor's Interest
Recorded: 2021-09-17
Pages: 7
Assignor
YUKIIRI, YUJI
Executed: 2021-08-27
Assignee
SHINKO ELECTRIC INDUSTRIES CO., LTD.
80, OSHIMADA-MACHI, NAGANO-SHI,, NAGANO, 381-2287, JAPAN
Covered Property
(1)
Interconnect Substrate and Method of Making the Same