Patent Assignment
Reel/Frame 057555/0401
Assignment of Assignor's Interest
Recorded: 2021-09-22
Pages: 3
Assignors
WU, PO-HAN
Executed: 2021-09-10
TSAI, PAI-CHUN
Executed: 2021-09-10
YANG, TZU-MING OU
Executed: 2021-09-10
LEE, SHU-MING
Executed: 2021-09-10
Assignee
WINBOND ELECTRONICS CORP.
NO. 8 KEYA 1ST RD., DAYA DISTRICT, CENTRAL TAIWAN SCIENCE PARK, TAICHUNG CITY, TAIWAN
Covered Property
(1)
Method of Manufacturing Semiconductor Structure
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.