Patent Assignment
Reel/Frame 057568/0659
Assignment of Assignor's Interest
Recorded: 2021-09-23
Pages: 7
Assignors
HUANG, SHIH-YA
Executed: 2021-09-14
TSAI, CHUNG-HAO
Executed: 2020-01-21
YU, CHEN-HUA
Executed: 2020-01-21
WANG, CHUEI-TANG
Executed: 2020-01-21
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 30078, TAIWAN
Covered Property
(1)
Passive Device Module, Semiconductor Package Including the Same, and Manufacturing Method Thereof