IP Library › Assignment 057574/0145
Patent Assignment
Reel/Frame 057574/0145

Assignment of Assignor's Interest

Recorded: 2021-09-23 Pages: 3
Assignors
KUO, FENG-WEI
Executed: 2019-11-06
LIAO, WEN-SHIANG
Executed: 2019-11-06
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARY, HSINCHU, 300-77, TAIWAN
Covered Property (1)
Embedded Metal Insulator Metal Structure
Application: 16/690,535 →
Publication: US 2021/0028095