Patent Assignment
Reel/Frame 057575/0111
Assignment of Assignor's Interest
Recorded: 2021-09-23
Pages: 5
Assignors
YANG, YUANCHENG
Executed: 2021-09-01
ZHOU, WENXI
Executed: 2021-09-01
XIA, ZHILIANG
Executed: 2021-09-01
LIU, WEI
Executed: 2021-09-07
Assignee
YANGTZE MEMORY TECHNOLOGIES CO., LTD.
18 GAOXIN 4TH ROAD, EAST LAKE HIGH-TECH DEVELOPMENT ZONE, WUHAN, HUBEI, CHINA
Covered Property
(1)
Three-Dimensional Memory Devices Having First Semiconductor Structure Bonded with Second Semiconductor Structure Each Including Peripheral Circuit and Methods for Forming the Same