Patent Assignment
Reel/Frame 057577/0400
Assignment of Assignor's Interest
Recorded: 2021-09-23
Pages: 7
Assignors
WOO, BYUNGSUK
Executed: 2021-07-23
SEOL, CHANGKYU
Executed: 2021-07-26
PARK, CHEOLMIN
Executed: 2021-07-26
LEE, SUCHEOL
Executed: 2021-07-26
PARK, CHANIK
Executed: 2021-08-02
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU,, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
High Bandwidth Memory System Using Multilevel Signaling