Patent Assignment
Reel/Frame 057579/0648
Assignment of Assignor's Interest
Recorded: 2021-09-23
Pages: 9
Assignors
HOSOI, TOSHIHIRO
Executed: 2021-08-31
FUKUDA, KENSHIRO
Executed: 2021-08-31
YONEDA, YOSHIHIRO
Executed: 2021-08-31
ISHINO, TOMOHIRO
Executed: 2021-09-20
SATO, TETSURO
Executed: 2021-08-02
Assignee
MITSUI MINING & SMELTING CO., LTD.
1-11-1 OSAKI, SHINAGAWA-KU, TOKYO, 1418584, JAPAN
Covered Property
(1)
Resin Composition, Copper Foil with Resin, Dielectric Layer, Copper-Clad Laminate, Capacitor Element, and Printed Wiring Board with Built-in Capacitor
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.