Patent Assignment
Reel/Frame 057587/0943
Assignment of Assignor's Interest
Recorded: 2021-09-24
Pages: 3
Assignors
YANG, CHI-HAN
Executed: 2021-09-08
CHEN, LUNG-HUI
Executed: 2021-09-22
CHEN, KUAN-YU
Executed: 2021-09-07
WEI, SHIH CHAN
Executed: 2021-09-10
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Metal-Insulator-Metal Capacitor Within Metallization Structure