Patent Assignment
Reel/Frame 057594/0567
Assignment of Assignor's Interest
Recorded: 2021-09-24
Pages: 4
Assignors
GAO, GUILIAN
Executed: 2019-09-17
UZOH, CYPRIAN EMEKA
Executed: 2019-09-18
THEIL, JEREMY ALFRED
Executed: 2019-09-17
HABA, BELGACEM
Executed: 2019-09-23
KATKAR, RAJESH
Executed: 2019-09-17
Assignee
INVENSAS BONDING TECHNOLOGIES, INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property
(1)
Molded Direct Bonded and Interconnected Stack
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
May 19, 2023
From: ADEIA GUIDES INC.; ADEIA MEDIA HOLDINGS LLC; ADEIA MEDIA SOLUTIONS INC.; ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 063707/0884 →
Change of Name
Jul 7, 2023
From: INVENSAS BONDING TECHNOLOGIES, INC.
To: ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Reel/Frame 064235/0279 →