Patent Assignment
Reel/Frame 057600/0112
Assignment of Assignor's Interest
Recorded: 2021-09-26
Pages: 4
Assignors
LI, LINPING
Executed: 2021-09-16
SHENG, JINGHAO
Executed: 2021-09-17
JIANG, ZHOU
Executed: 2021-09-22
Assignee
HUZHOU JIANWENLU TECHNOLOGIES INC.
ROOM 1219-11, BUILDING 3, NO.1366, HONGFENG ROAD, KANGSHAN SUB-DISTRICT,, HUZHOU ECONOMIC AND TECHNOLOGICAL DEVELOPMENT ZONE,, HUZHOU, 313000, CHINA
Covered Property
(1)
Chip Packaging Method and Chip Packaging Structure
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.